Import 10l High Density Printed Circuit Board — Buy in Bulk from Supplier in China

This 10-layer high density interconnect (HDI) PCB from Hitech Circuits Co., Limited is built on FR4 substrate with a Tg170 glass transition temperature, a specification that ensures stable performance in thermally demanding environments. The board carries a 1.0mm thickness with 0.5oz copper layers, and achieves a minimum line width and line spacing of 0.1mm, reflecting the fine-pitch routing capability required for compact, high-pin-count component packages. The stack-up follows a 1+8+1 configuration with laser-drilled microvias and blind and buried vias, enabling dense interconnection between layers without consuming additional board area.

Immersion gold (ENIG) surface finishing provides a flat, solderable pad surface suitable for fine-pitch BGA and QFP assembly, while the controlled impedance traces support high-speed digital and RF signal integrity. A typical 10-layer HDI board of this class uses sequential lamination cycles and laser via diameters in the 75 to 100 micron range, though exact process parameters should be confirmed with Hitech Circuits directly. The Tg170 base material is a common choice for lead-free reflow soldering profiles where peak temperatures reach 245 to 250 degrees Celsius.

These boards are sourced by electronics manufacturers in telecommunications, consumer electronics, automotive infotainment, and industrial control sectors where component density and signal performance are critical. Buyers evaluating this listing should confirm minimum order quantity, panelisation options, and lead time with Hitech Circuits, as these details are not specified in the listing. The Shenzhen-based supplier operates within the Pearl River Delta electronics manufacturing cluster, a region with mature PCB fabrication and assembly infrastructure.

Hitech Circuits Co., Limited is a PCB manufacturer based in Songgang, Bao'an District, Shenzhen, Guangdong, China, at postal code 518100. The company holds a harbour-level trust tier on the listing platform, though its response rate and average response time are currently reported as zero, which means buyers should expect to allow additional time for initial correspondence or follow up through alternative contact methods.

The listing demonstrates Hitech Circuits' capability in HDI fabrication, specifically in 10-layer sequential lamination with laser microvia technology. No information is provided about the company's production capacity, certifications such as ISO 9001 or IPC membership, or years in operation, so buyers are advised to request these details directly before placing orders. The Shenzhen location places the supplier within a major global hub for PCB manufacturing, with access to established logistics routes for international shipping.