About Shenzhen Hemeixin Electronic Co., Ltd. - PCB Supplier in China

Shenzhen Hemeixin Electronic Co., Ltd. is based in Shenzhen, China and currently lists nine active products. The catalogue focuses on printed circuit board (PCB) formats, covering single‑sided aluminum substrates, multilayer FR‑4 boards, flex‑rigid hybrids, and ultra‑thick constructions. Product titles reference layer counts such as 2L, 4L and 8L, material types like aluminum and FR‑4, and specific features including blue or black soldermask, OSP surface finish, and blind or buried vias of 20 µm diameter. The supplier’s classification as an imported, harbor‑tier provider indicates it operates through overseas buyers rather than direct domestic sales.

The listed items span a range of standard PCB specifications used in electronic assemblies. Examples include a 2 mm thick 2‑layer flex‑rigid board, a 3.2 mm thick 20‑layer board with blind/buried vias, and an 8‑layer FR‑4 board with 1.6 mm thickness and blue soldermask. While the catalogue does not provide HS codes, these products fall under the HS chapter 84 (machinery and electrical equipment) and are commonly coded under 8473.30 for printed circuit assemblies. No additional company history, employee numbers or revenue data are supplied.

Product Range and Specialties of Shenzhen Hemeixin Electronic Co., Ltd.

The catalogue comprises single‑sided aluminum boards, 2‑layer and 4‑layer flex‑rigid boards, OSP‑finished boards, and ultra‑thick substrates. In the PCB industry, aluminum core boards are typically used for LED lighting and power modules, with copper thickness ranging from 1 oz to 2 oz per square foot. FR‑4 boards such as the 8‑layer, 1.6 mm product are standard for high‑frequency and high‑density applications, often meeting IPC‑2221 standards for material dielectric constant (≈4.5) and Tg ≈ 130 °C. Flex‑rigid hybrids combine polyimide flex layers with rigid FR‑4 cores, allowing bend radii as low as 5 mm while maintaining layer stack‑up integrity. Ultra‑thick boards, exceeding 3 mm, are employed where mechanical strength or heat dissipation is critical, and they may be specified with copper weights up to 3 oz/ft².

Trade and Export Information - Shenzhen Hemeixin Electronic Co., Ltd.

China is a leading exporter of PCBs, with major inbound markets in North America, Western Europe and Southeast Asia. HS code 8473.30 covers most multilayer printed circuit boards, while aluminum core boards may be classified under 8473.50. Buyers typically request compliance with RoHS, IEC‑60950 or IEC‑62368 safety standards, and many importers require IPC‑A‑610 acceptability reports. Export shipments are frequently dispatched in 20‑ft or 40‑ft containers, using anti‑static packaging and moisture barrier bags to preserve dielectric properties during transit. Chinese PCB manufacturers often hold UL and CE certifications, but these must be verified for each product batch.

Logistics for PCB orders commonly involve FOB Shenzhen ports, with subsequent air freight for prototypes or sea freight for bulk volumes. Customs inspections may check for correct HS classification, material safety data sheets (MSDS) for copper and resin, and conformity with local electromagnetic compatibility (EMC) regulations. Importers from the EU frequently request EU‑type test reports, while US buyers look for UL 796 or IPC‑2222 documentation. The supplier’s harbor‑tier status suggests it works through established freight forwarders and may provide consolidated shipments for multiple buyers.

Sourcing from Shenzhen Hemeixin Electronic Co., Ltd. - Buyer Guidance

When sourcing PCBs from Shenzhen Hemeixin Electronic Co., Ltd., request the full technical data sheet for each board type, including copper weight, dielectric constant, Tg, and soldermask thickness. Verify that the OSP‑finished boards meet IPC‑A‑610 Class II standards and that blind/buried via specifications include via diameter and plating thickness (typically ≥ 0.025 mm). Ask for sample panels and an IPC‑2221 compliance certificate before confirming large orders; these documents help confirm material consistency and dimensional tolerances.

Typical minimum order quantities for standard 2‑layer or 4‑layer boards range from 500 pcs to 1 000 pcs, while high‑layer counts such as the 20‑layer blind/buried via board may start at 100 pcs due to higher setup costs. Lead times in China for standard FR‑4 boards are usually 10‑15 working days after artwork approval, whereas flex‑rigid or ultra‑thick boards may require 20‑25 days. Confirm packaging details - most suppliers use anti‑static foam and sealed moisture barrier bags, with pallets sized for 20‑ft containers. Ensure that any required certifications (RoHS, UL, CE) are included in the shipping documents.

What PCB material options does Shenzhen Hemeixin Electronic Co., Ltd. offer?

The catalogue lists aluminum core boards, standard FR‑4 boards, and flex‑rigid hybrids. Aluminum boards are used for high‑heat applications, FR‑4 for general electronics, and flex‑rigid for designs requiring bendable sections.

Which surface finish is available for the listed boards?

An OSP (Organic Solderability Preservative) finish is mentioned for one product, which is common for lead‑free soldering and meets IPC‑A‑610 Class II requirements.

How many layers are supported in the supplier’s PCB range?

Products include 2‑layer, 4‑layer, 8‑layer, and a 20‑layer board with blind/buried vias, covering low to very high density interconnect needs.

What soldermask colors are offered?

The catalogue specifies blue soldermask for an 8‑layer FR‑4 board and black soldermask for a 4‑layer board, which are standard color options in the industry.

What documentation should a buyer request before purchasing?

Buyers should ask for a technical data sheet, IPC‑2221 compliance report, RoHS declaration, and, where applicable, UL or CE certification copies.

What are typical packaging and shipping methods for these PCBs?

PCBs are normally packed in anti‑static foam, sealed in moisture‑barrier bags, and palletized for container loading. Shipping is commonly FOB Shenzhen with sea freight for bulk orders.

Are blind or buried vias available on the supplier’s boards?

Yes, a 20‑layer board with blind/buried vias of 3.2 mm thickness is listed, which aligns with industry practice for high‑density multilayer designs.

What are the usual lead times for standard versus high‑layer count boards?

Standard 2‑layer to 8‑layer boards typically require 10‑15 working days after artwork approval, while the 20‑layer blind/buried via board may need 20‑25 days due to additional processing steps.