Import Communication Equipment Pcb Assembly — Buy in Bulk from Supplier in China

The Communication Equipment PCB Assembly offered by Shenzhen Grande Electronics Co., Ltd. is a surface-mount technology (SMT) solution designed for high-reliability applications in telecommunications, RF microelectronics and data transmission systems. The assembly supports advanced components such as 0201 packages, fine-pitch BGAs, Package on Package (POP) and Chip on Board configurations, enabling compact, high-performance designs for modern communication devices. The supplier’s capabilities extend to hybrid processes, combining tin-lead and lead-free soldering to meet diverse industry standards.

Materials and construction adhere to industry norms for PCB assemblies, with FR-4 or high-frequency laminates used as base materials depending on the application. Typical specifications include a minimum trace width of 0.1mm, via hole sizes down to 0.2mm and impedance control for high-speed signal integrity. The assemblies are RoHS compliant, with conformal or parylene coating options available for environmental protection. Inspection and testing are performed using SPI, AOI, Flying Probe and X-Ray equipment to ensure defect-free production.

This product is sourced by OEMs and contract manufacturers producing routers, switches, base stations and other communication infrastructure. Buyers often require prototyping and low-volume high-mix production before scaling to high-volume manufacturing. Shenzhen Grande Electronics operates from Shenzhen, Guangdong, with facilities also located in Europe, Asia and the Americas. Trade terms such as MOQ, lead time and packaging are not specified and must be confirmed directly with the supplier.

Shenzhen Grande Electronics Co., Ltd. is a PCB assembly specialist with over 20 years of experience in advanced electronics manufacturing. Based in Shenzhen, Guangdong, the company operates from Room A510-511, Automobile Mansion, No.45 Zhenhua Road, Futian District. Its expertise spans prototyping, low-volume high-mix production and high-volume global manufacturing, supported by a network of over 40 facilities across Europe, Asia and the Americas.

The supplier’s profile highlights its leadership in developing the latest PCBA and SMT capabilities, including support for RF microelectronics, fiber optics and press-fit connectors. While the listing does not specify certifications beyond RoHS compliance, it mentions comprehensive electrical testing and test system development for boundary scan, in-circuit test (ICT) and functional verification. The company’s trust tier is harbor, with a current response rate of 0.00%, suggesting either a new listing or limited engagement history.