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Construction & real estate›💡Electronic & Electrical›🍎Food & Beverages›🛋️Home furnishing & supplies›⚗️Industrial goods & chemical›🪨Minerals & metals›📦Miscellaneous›
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Construction & real estate›💡Electronic & Electrical›🍎Food & Beverages›🛋️Home furnishing & supplies›⚗️Industrial goods & chemical›🪨Minerals & metals›📦Miscellaneous›The 6-Layer HDI F4B PCB from Shenzhen Longxiang Intellectual Technology Co., Ltd. is a high-density interconnect printed circuit board built on F4B substrate, a low-loss fluoropolymer composite material valued in RF and microwave applications. The board measures 1.6mm in finished thickness with minimum trace width and space of 3.5mil (0.089mm) and minimum drilled hole size of 0.15mm (6mil). This construction employs blind and buried vias to achieve denser routing in a compact footprint than conventional through-hole multilayer designs.
F4B material exhibits a typical dielectric constant of 2.65 and dissipation factor below 0.003 at 10GHz, making it suitable for 5G base stations, satellite communications, and radar systems where signal integrity at microwave frequencies is critical. The six-layer stackup allows dedicated power and ground planes with controlled impedance on signal layers. Copper thickness options range from 0.5oz to 6oz (17.5 to 210 micrometres), with inner-layer copper greater than 18 micrometres in plated through-holes. Surface finish choices include immersion gold (ENIG), immersion silver, immersion tin, lead-free HASL, and OSP, selected according to assembly process and shelf-life requirements.
Shenzhen Longxiang Intellectual Technology Co., Ltd. manufactures this board at their facility in Baoan District, Shenzhen, with maximum panel size of 580 x 900mm and outline tolerance of plus or minus 0.13mm. Target markets include projector manufacturers, telecommunications equipment producers, and aerospace contractors requiring impedance control and via-plugging capabilities. OEM and assembly services are offered alongside bare board fabrication. Buyers should confirm current lead times, minimum order quantities, and whether UL file and TS16949:2002 certification documentation is active and current, as the source description references these marks without verification of validity.
| Layer Count | 6 layers (HDI with blind and buried vias) |
| Finished Thickness | 1.6mm (as specified; 0.2 to 7.0mm typical range available) |
| Base Material | F4B (fluoropolymer composite, low-loss microwave substrate) |
| Dielectric Constant | Approximately 2.65 at 10GHz (typical for F4B grade) |
| Dissipation Factor | Less than 0.003 at 10GHz (typical for F4B grade) |
| Minimum Trace Width/Space | 3.5mil / 3.5mil (0.089mm / 0.089mm) |
| Minimum Drilled Hole | 0.15mm (6mil) |
| Hole Size Tolerance | PTH: plus or minus 0.076mm; NPTH: plus or minus 0.05mm |
| Copper Thickness (Outer) | 0.5oz to 6oz (17.5 to 210 micrometres, typical range) |
| Copper in Hole (Minimum) | Greater than 18 micrometres (plated through-hole) |
Shenzhen Longxiang Intellectual Technology Co., Ltd. is located at Room 318, Zhihuichuangxin Center, Qianjin 2Road, Xixiang, Baoan District, Shenzhen 518101, Guangdong, China. The company holds a harbour trust tier with a 0.00% response rate and zero recorded average response hours, suggesting that platform-mediated enquiries may not receive prompt replies. Buyers are encouraged to contact the company directly at their Baoan District address for technical discussions and quotation requests.
The source description references UL marking and TS16949:2002 certification without providing certificate numbers, scope, or expiration dates, so buyers must independently verify the current validity of these claims. No information is given about year of establishment, production floor space, number of employees, annual revenue, or major customers. The listing does indicate capability across 1 to 28 layer counts and multiple material systems (FR-4, CEM-3, high Tg, halogen-free FR4, Rogers, and F4B), which suggests a flexible manufacturing operation rather than a single-product facility. Request a facility audit or third-party manufacturing assessment before committing to volume orders.
| 企业类型 | Supplier |
| 成立年份 | Contact Supplier |
| Employees | Contact Supplier |
| Annual Revenue | Contact Supplier |
| Main Products | View Products Tab |
| Major Markets | Global |
| 响应时间 | <4h |
| 响应率 | Contact Supplier |
Before committing to Shenzhen Longxiang Intellectual Technology Co., Ltd., verify that their UL file is current and covers the specific F4B material and layer count you require, as UL listings are material and construction specific. Request actual sample boards with full test reports including cross-sections, impedance TDR traces, and thermal stress testing per IPC-TM-650 2.6.8. The 0.00% platform response rate means direct contact to their Baoan District facility is advisable; request references from existing customers in your industry segment and confirm whether they have experience with your application's specific reliability requirements, such as MIL-PRF-31032 or IPC-6012 Class 3.
Logistics and trade terms require clarification given the specialised nature of F4B substrate. Confirm whether Shenzhen Longxiang holds stock of F4B laminate or procures it on demand, as this affects lead time significantly (typical raw material lead time for fluoropolymer composites is 4 to 8 weeks). Ask about Incoterms: EXW Shenzhen, FCA Hong Kong, or DAP your facility, and who arranges customs clearance and freight forwarding. For North American or European buyers, consider whether the supplier has experience with FCC, CE marking, or ITAR requirements if your end product falls under these regimes. Payment terms, letter of credit acceptance, and currency should be negotiated directly.
Incoming inspection of HDI boards should include automated optical inspection (AOI) of a sample panel against Gerber data, microsectioning to verify layer registration, dielectric thickness, and copper plating uniformity, and TDR impedance measurement on test coupons. Retain one panel from each lot for future failure analysis. For ongoing production, establish an approved vendor list (AVL) for laminate sources and specify that substrate lot changes require prior notification and requalification. Consider engaging a third-party inspection firm in Shenzhen for pre-shipment verification, particularly for first article and after any process change notification from the supplier.
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从China进口6-Layer Hdi F4b Pcb时,买家应考虑运输条款(FOB、CIF、EXW)、清关文件要求以及付款安全。请联系供应商,商议最适合目的国的物流方案。
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FOB、CIF、EXW 等运输条款均可直接与Shenzhen Longxiang Intellectual Technology Co., Ltd.协商。请联系供应商,商议最适合将6-Layer Hdi F4b Pcb进口至您所在国家的物流方案。
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Shenzhen Longxiang Intellectual Technology Co., Ltd.是 EximNext 平台注册并认证的供应商。建议使用平台的安全消息系统以及标准国际支付方式(L/C、T/T、担保交易)完成交易。
请向Shenzhen Longxiang Intellectual Technology Co., Ltd.索取详细的产品资料,包括等级、纯度、尺寸、材质成分以及适用的行业标准。
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