Import Bga Printed Circuit Board 12 Layers Rigid Pcb — Buy in wholesale FOB from Supplier in China

Shenzhen Derek Tech Co., Ltd produces rigid printed circuit boards including this 12-layer BGA-capable design fabricated on FR4 or high-TG FR4 substrate. The board supports fine-pitch BGA routing through blind and buried via constructions, with minimum line width and space of 3 mil and 2 mil respectively. Copper weight ranges from 0.5 oz to 6 oz per square foot, accommodating both signal integrity and power distribution requirements in dense multilayer stacks. Panel size capability extends to 600 mm by 600 mm for multilayer constructions, with outline profiling via routing, V-scoring, bridge tabs or stamp hole breakaway depending on assembly and depanelization needs.

Base material options span standard FR4 through high-TG FR4, CEM-3, aluminum and specialty laminates including Rogers and Arlon for controlled impedance or RF applications. Surface finish choices include OSP, HASL, ENIG, ENEPIG, immersion tin, immersion gold, silver, gold plating, hard gold and carbon ink, each selected for solderability, wire bond compatibility, contact resistance or wear resistance as the application demands. Solder mask is available in green, black, red, blue, yellow and white; silkscreen in white, blue and black. The supplier performs 100 percent electrical performance testing via flying probe or fixture-based methods, with minimum drilled hole size of 0.2 mm and laser-drilled microvia capability at 0.1 mm.

This 12-layer rigid PCB targets telecommunications infrastructure, industrial control systems, medical imaging equipment and high-performance computing platforms where BGA devices require robust power and ground planes. Buyers should confirm layer stackup details, impedance control tolerances and specific dielectric constants for their frequency requirements. The supplier's capability to 56 layers and buried/blind via technology suggests experience with complex sequential lamination, though buyers should request qualification data and sample boards for first-article validation before volume commitment.

Shenzhen Derek Tech Co., Ltd is located at Heng Gangxia Industrial Park in Xinqiao, Shajing, Bao'an District, Shenzhen, Guangdong Province, China. The supplier holds harbor trust tier classification. Response metrics show a 0.00 percent response rate and zero average response hours, indicating limited communication history on the platform. The company specializes in multilayer rigid, flexible, rigid-flex and HDI printed circuit board fabrication with broad material and finish capabilities.

The supplier's equipment base and certifications are not detailed in the available profile data. The listing does not disclose factory floor space, annual capacity, ISO quality system registration, IATF automotive certification, environmental compliance status or named customer references. Buyers should independently verify quality management system registration, UL file numbers for flammability ratings, and ITAR or export control status if applicable to their industry. Direct engagement with the supplier is essential to assess technical support depth, design review capability and engineering change responsiveness.