Import 3.2mm, 20l Blind/Buried Vias — Buy in Bulk from Supplier in China

Shenzhen Hemeixin Electronic Co., Ltd. fabricates 3.2mm diameter, 20-layer blind and buried vias for high-density interconnect (HDI) printed circuit boards, enabling vertical interconnection between selected layers without penetrating the entire board stackup. The 3.2mm via diameter provides substantial cross-sectional area for current carrying and signal routing in demanding electronic applications. Blind vias connect an outer layer to one or more inner layers, while buried vias connect only internal layers, both configurations reducing stub effects and freeing surface real estate compared to through-hole alternatives. The 20-layer count indicates capability for complex multilayer constructions typical of advanced telecommunications infrastructure, server motherboards and automotive control modules. Copper plating forms the conductive barrel, with the supplier emphasising durability and conductivity as key performance parameters.

The physical construction involves sequential lamination with controlled-depth drilling or laser ablation for blind vias, and internal layer pair fabrication with subsequent outer layer buildup for buried vias. Standard copper plating thickness for via barrels in high-reliability applications typically ranges from 20 micrometres to 25 micrometres minimum, with thicker deposits for thermal management or high-current paths. The 3.2mm diameter accommodates standard mechanical drilling processes with appropriate aspect ratio considerations for 20-layer constructions, where total board thickness may reach 3.0mm to 4.0mm. Aspect ratio (board thickness to via diameter) is a critical manufacturability parameter, with typical PCB fabricator capabilities at 10:1 to 15:1 for mechanical drilling and up to 20:1 for laser drilling. Surface finish compatibility with ENIG, OSP or immersion tin should be confirmed for the specific application environment.

Target applications include telecommunications baseband processing equipment, automotive engine control units and advanced driver-assistance systems, industrial automation controllers and high-performance computing hardware where layer count and routing density preclude traditional through-hole designs. The supplier's location in Shenzhen, within the Pearl River Delta electronics manufacturing cluster, provides proximity to component supply chains and EMS providers. Buyers should verify the supplier's specific certifications, as the source description mentions ISO and SGS without identifying scope or validity dates. Trade terms including FOB and CIF are referenced, with L/C and T/T payment options, though exact minimum order quantities and lead times require direct confirmation with Shenzhen Hemeixin Electronic given platform data limitations. Technical qualification should include cross-sectional analysis of sample vias for plating uniformity, barrel integrity and registration accuracy to your layer stackup design.

Shenzhen Hemeixin Electronic Co., Ltd. is located at South Of 5th Floor, 7 Building, Wanxia Industrial Park, Tongfuyu la Industrial Area, Shajing Street, Shenzhen 518101, Guangdong Province, China, placing it within the established Shenzhen electronics manufacturing corridor. The supplier holds a harbor trust tier with imported supplier tier designation, alongside a recorded response rate of 0.00 percent and zero average response hours, indicating no tracked enquiry activity on the platform. The company specialises in PCB manufacturing with emphasis on high-layer-count and HDI constructions, as evidenced by the 20-layer blind/buried via product offering. The source description references ISO and SGS certifications without specifying standards, scopes or certificate numbers, which buyers must verify independently through accredited certification body databases.

The supplier's operational scale, headcount, revenue figures and named client base are not disclosed in available source material, and should not be assumed. The imported supplier tier suggests some foreign market engagement, though specific export experience, language capabilities of sales and engineering staff, and dedicated quality personnel are unverified. The physical address in an industrial park rather than purpose-built manufacturing facility may indicate EMS or trading operation; site verification through video tour or third-party factory audit is advisable. Payment terms referenced include L/C and T/T, suggesting some flexibility for international trade, yet buyers should negotiate secure payment structures given limited responsiveness data and unverified certification claims. No information is provided on in-house versus outsourced processes, testing equipment, or engineering support for DFM feedback on via structures.