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Construction & real estate›💡Electronic & Electrical›🍎Food & Beverages›🛋️Home furnishing & supplies›⚗️Industrial goods & chemical›🪨Minerals & metals›📦Miscellaneous›
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Construction & real estate›💡Electronic & Electrical›🍎Food & Beverages›🛋️Home furnishing & supplies›⚗️Industrial goods & chemical›🪨Minerals & metals›📦Miscellaneous›This 8-layer PCB is designed for high-performance electronics, featuring a minimum line width and space of 4 mil, which allows for dense circuit layouts. The board has a thickness of 1.20 mm and uses immersion gold as the surface finish, providing excellent conductivity and corrosion resistance. The minimum drilled hole diameter is 0.8 mm, accommodating fine-pitch components like BGAs, while the golden fingers enable reliable edge connections.
The immersion gold finish is applied over a nickel barrier, typically 3 to 6 µm thick, which prevents copper diffusion and ensures long-term solderability. BGAs (Ball Grid Arrays) on this PCB are suited for high-speed signal routing, with standard ball pitches ranging from 0.4 mm to 1.0 mm. Golden fingers, plated with hard gold (typically 1 to 3 µm), are used for edge connectors and are rated for at least 1,000 insertion cycles in standard applications.
These PCBs are used in telecommunications, consumer electronics, and automotive systems where high-density interconnects and reliable edge connections are required. The 8-layer stack-up typically includes two to four signal layers, two to four plane layers, and prepreg materials with a standard dielectric constant of 4.2. Buyers often source these in panel sizes of 18 by 24 inches, with a standard copper thickness of 1 oz (35 µm) for outer layers and 0.5 oz (18 µm) for inner layers.
| Layer Count | 8 layers |
| Minimum Line Width/Space | 4 mil / 4 mil |
| Board Thickness | 1.20 mm |
| Surface Finish | Immersion gold |
| Minimum Drilled Hole Diameter | 0.8 mm |
| Golden Fingers Plating | Hard gold (typical 1 to 3 µm) |
| Nickel Barrier Thickness | 3 to 6 µm (typical for ENIG) |
| Typical BGA Ball Pitch | 0.4 mm to 1.0 mm (standard) |
| Typical Dielectric Constant | 4.2 (standard for FR-4) |
| Typical Copper Thickness (Outer Layers) | 35 µm (1 oz, standard) |
| Typical Copper Thickness (Inner Layers) | 18 µm (0.5 oz, standard) |
| Panel Size | 18 by 24 inches (standard) |
| Golden Fingers Insertion Cycle Rating | 1,000 cycles (standard) |
Cyzon Limited is based in the Huafeng Building on Yuan Road in Shenzhen, Guangdong, a region known for its concentration of electronics manufacturing suppliers. The company is classified as an imported-tier seller with a harbor-level trust signal, indicating verified trade activity but no recorded response metrics in the current data.
The supplier lists this 8-layer PCB with BGA and golden fingers as a high-precision product, with specifications tailored for complex electronic applications. No additional details about certifications, production scale, or client history are provided, so buyers should directly confirm compliance with their technical and quality standards.
| 企业类型 | Supplier |
| 成立年份 | Contact Supplier |
| Employees | Contact Supplier |
| Annual Revenue | Contact Supplier |
| Main Products | View Products Tab |
| Major Markets | Global |
| 响应时间 | <4h |
| 响应率 | Contact Supplier |
Before placing an order, confirm that the supplier can produce PCBs to your exact Gerber files and impedance requirements, as 8-layer designs often demand tight tolerances. Request a DFM review to check for issues like drill-to-copper spacing or annular ring sizes that may not meet production standards. Verify whether the supplier supports controlled impedance testing, which is critical for high-speed signals.
Logistics for these PCBs usually involve air freight due to their sensitivity to moisture and static. Lead times for prototypes can be 10 to 15 working days, while production runs may take 20 to 30 days. Confirm the Incoterms (e.g., FOB Shenzhen) and whether the supplier provides anti-static packaging and moisture barrier bags, as these are essential for protecting the immersion gold finish and BGA pads.
Quality checks should include automated optical inspection (AOI) for solder mask alignment and silkscreen accuracy, as well as flying probe or fixture testing for electrical continuity. Request a first-article inspection report that includes cross-section analysis of the golden fingers’ plating thickness and the ENIG finish’s nickel and gold layers. For critical applications, consider third-party inspection to validate the BGA pad flatness and the board’s overall flatness tolerance (typically ±0.75 percent).
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点击"索取报价"按钮直接联系Cyzon Limited。供应商将根据您的批量需求和运输目的地提供定制报价。
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请向Cyzon Limited索取详细的产品资料,包括等级、纯度、尺寸、材质成分以及适用的行业标准。
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