Import Gold Finger Printed Circuit Board — Buy in Bulk from Supplier in China

The Gold finger printed circuit board offered by Teson Tech Co., Ltd. is a multilayer PCB designed for high‑frequency and high‑current applications. The factory can produce volume orders with 2 to 18 layers and prototype runs with 2 to 24 layers, allowing flexibility for complex designs. Board thickness and copper weight are not fixed in the listing, so buyers should specify their required values during quotation. The standard visual inspection and flying‑probe testing are applied to every panel before shipment.

Typical PCBs use an FR‑4 epoxy glass substrate, a dielectric constant of about 4.5, and copper cladding of 1 oz/ft², which matches the performance range of Teson’s offerings. Common surface finishes such as ENIG, HASL or OSP can be selected, and the solder mask is usually green, although colour can be customised. The company also produces specialised boards like backplane, metal‑core, high‑TG and flex‑rigid types, indicating capability across a wide technology spectrum.

Manufacturers of telecommunications equipment, automotive electronics, aerospace and industrial control systems often require such gold‑finger PCBs for reliable high‑density interconnects. Importers should provide Gerber files, bill of material and any special testing requirements to obtain an accurate quotation. While the listing does not state minimum order quantity, payment terms and incoterms are typically negotiated after the technical quotation is confirmed.

Teson Tech Co., Ltd. operates from Block C, Sifangpu Industry Park in the Longgang District of Shenzhen, Guangdong, China. The company is classified as an imported‑tier supplier with a harbor trust level, indicating it meets basic verification criteria on the platform. It specialises in PCB fabrication and assembly, covering volume runs of 2‑18 layers and prototype runs up to 24 layers.

The factory lists an extensive quality‑assurance chain that includes 100 % visual inspection, metal and copper thickness measurement, via hole testing, flying‑probe and AOI, as well as impedance control and solder‑ability checks. Response metrics show a 0 % response rate and no average response time, suggesting communication may require proactive outreach from the buyer.