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This 20-layer PCB from Shenzhen Hemeixin Electronics Co., Ltd. uses FR-4 TG170 as the base material with a board thickness of 3.2mm ± 0.3mm, designed for high-density interconnect applications. All copper layers are plated to 2OZ, and the board incorporates blind and buried vias with a minimum hole diameter of 0.50mm (19mil), supporting advanced routing requirements. Surface finishing is ENIG, ensuring reliable solderability and corrosion resistance for long-term performance.
The PCB features a minimum trace width and spacing of 0.20mm (8mil), enabling tight routing in compact designs. Panel dimensions are 106.63mm x 134.42mm with a 6up configuration arranged as 2x3, and the design includes 2-step blind vias (dr1-2, dr3-4) with a via diameter of 0.5mm (19mil). Testing is performed via flying probe to verify electrical continuity and isolation, a standard method for high-layer-count boards.
This board is suited for applications requiring high-layer density, such as telecommunications equipment, industrial control systems, and advanced computing hardware. Buyers typically source these for prototypes or volume production, with lead times of 10 working days for expedited orders or 15-20 working days for standard delivery. The ENIG finish and FR-4 TG170 material are standard choices for reliability in demanding thermal environments.
| Layer Count | 20L |
| Base Material | FR-4 TG170 |
| Copper Thickness | 2OZ (all layers) |
| Board Thickness | 3.2mm ± 0.3mm |
| Minimum Hole Diameter | 0.50mm (19mil) |
| Minimum Trace Width | 0.20mm (8mil) |
| Minimum Trace Spacing | 0.20mm (8mil) |
| Surface Finishing | ENIG |
| Test Method | Flying Probe |
| Panel Dimension | 106.63mm x 134.42mm |
| Panel Method | 6up, 2x3 |
| Blind Via Configuration | 2-step blind vias (dr1-2, dr3-4) |
| Via Diameter | 0.5mm (19mil) |
| Typical Thermal Conductivity | standard 0.3 W/m·K for FR-4 |
| Typical Dielectric Strength | standard 40 kV/mm for FR-4 TG170 |
| Typical Tg (Glass Transition Temperature) | 170°C |
| Lead Time | fastest 10 working days, normal 15-20 working days |
Shenzhen Hemeixin Electronics Co., Ltd. is based in Guangdong, Shenzhen, China, and operates as an imported-tier supplier specializing in high-layer-count PCBs. The company’s profile indicates a focus on advanced PCB manufacturing, with capabilities for blind and buried via technologies, which are critical for dense interconnect designs. The supplier’s address is confirmed as 518001, Shenzhen, and the trust tier is classified as harbor.
The supplier’s response rate is currently listed at 0.00, with an average response time of 0 hours, suggesting either a new or inactive profile. No additional verification signals, such as certifications or client references, are provided in the listing. Buyers should confirm manufacturing capabilities and quality control processes directly with the supplier before proceeding with orders, as the profile does not include detailed operational history or production metrics.
| Business Type | Supplier |
| Year Established | Recently Joined |
| Employees | Contact Supplier |
| Annual Revenue | Contact Supplier |
| Main Products | View Products Tab |
| Major Markets | Global |
| Response Time | <4h |
| Response Rate | New Supplier |
Before ordering, buyers should verify the PCB’s layer stack-up and via configurations to ensure they meet the design requirements. Confirming the FR-4 TG170 material and ENIG finishing is also critical, as these directly impact thermal performance and solderability. Requesting a sample or prototype for validation is recommended for high-density designs.
Logistics details such as packaging, shipping methods, and Incoterms should be clarified with Shenzhen Hemeixin Electronics Co., Ltd. The supplier’s location in Shenzhen may offer advantages for shipping within Asia, but buyers should confirm lead times for their specific destination. Payment terms, including deposits and final payment schedules, should also be agreed upon in advance.
Quality checks should include electrical testing to validate continuity and isolation, as well as visual inspections for defects like voids or misaligned vias. Buyers may request documentation such as test reports or certificates of compliance with industry standards like IPC-A-600. For high-reliability applications, additional inspections or third-party testing may be necessary to ensure the PCB meets performance expectations.
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Shipping terms such as FOB, CIF, or EXW can be negotiated directly with Shenzhen Hemeixin Electronics Co., Ltd.. Contact the supplier to discuss the best logistics options for importing 3.2mm, 20l Blind&Buried V to your country.
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