Import 3.2mm, 20l Blind&Buried Vias Board — Buy in Bulk from Supplier in China

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3.2mm, 20l Blind&Buried Vias Board by Shenzhen Hemeixin Electronics Co., Ltd.
Harbor
3.2mm, 20l Blind&Buried Vias Board - Image 1

3.2mm, 20l Blind&Buried Vias Board

🕐Last updated: Jul 20, 2026
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Min. Order: 1 Unit
📁CategoryProducts
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Buy & Import 3.2mm, 20l Blind & Buried Vias Board from Shenzhen Hemeixin Electronics Co., Ltd. - Wholesale Supply

This 20-layer PCB from Shenzhen Hemeixin Electronics Co., Ltd. uses FR-4 TG170 as the base material with a board thickness of 3.2mm ± 0.3mm, designed for high-density interconnect applications. All copper layers are plated to 2OZ, and the board incorporates blind and buried vias with a minimum hole diameter of 0.50mm (19mil), supporting advanced routing requirements. Surface finishing is ENIG, ensuring reliable solderability and corrosion resistance for long-term performance.

The PCB features a minimum trace width and spacing of 0.20mm (8mil), enabling tight routing in compact designs. Panel dimensions are 106.63mm x 134.42mm with a 6up configuration arranged as 2x3, and the design includes 2-step blind vias (dr1-2, dr3-4) with a via diameter of 0.5mm (19mil). Testing is performed via flying probe to verify electrical continuity and isolation, a standard method for high-layer-count boards.

This board is suited for applications requiring high-layer density, such as telecommunications equipment, industrial control systems, and advanced computing hardware. Buyers typically source these for prototypes or volume production, with lead times of 10 working days for expedited orders or 15-20 working days for standard delivery. The ENIG finish and FR-4 TG170 material are standard choices for reliability in demanding thermal environments.

Technical Specifications for Shenzhen Hemeixin Electronics Co., Ltd. 3.2mm, 20l Blind & Buried Vias Board
Layer Count20L
Base MaterialFR-4 TG170
Copper Thickness2OZ (all layers)
Board Thickness3.2mm ± 0.3mm
Minimum Hole Diameter0.50mm (19mil)
Minimum Trace Width0.20mm (8mil)
Minimum Trace Spacing0.20mm (8mil)
Surface FinishingENIG
Test MethodFlying Probe
Panel Dimension106.63mm x 134.42mm
Panel Method6up, 2x3
Blind Via Configuration2-step blind vias (dr1-2, dr3-4)
Via Diameter0.5mm (19mil)
Typical Thermal Conductivitystandard 0.3 W/m·K for FR-4
Typical Dielectric Strengthstandard 40 kV/mm for FR-4 TG170
Typical Tg (Glass Transition Temperature)170°C
Lead Timefastest 10 working days, normal 15-20 working days
About Shenzhen Hemeixin Electronics Co., Ltd. - PCB Supplier in China

Shenzhen Hemeixin Electronics Co., Ltd. is based in Guangdong, Shenzhen, China, and operates as an imported-tier supplier specializing in high-layer-count PCBs. The company’s profile indicates a focus on advanced PCB manufacturing, with capabilities for blind and buried via technologies, which are critical for dense interconnect designs. The supplier’s address is confirmed as 518001, Shenzhen, and the trust tier is classified as harbor.

The supplier’s response rate is currently listed at 0.00, with an average response time of 0 hours, suggesting either a new or inactive profile. No additional verification signals, such as certifications or client references, are provided in the listing. Buyers should confirm manufacturing capabilities and quality control processes directly with the supplier before proceeding with orders, as the profile does not include detailed operational history or production metrics.

Business TypeSupplier
Year EstablishedRecently Joined
EmployeesContact Supplier
Annual RevenueContact Supplier
Main ProductsView Products Tab
Major MarketsGlobal
Response Time<4h
Response RateNew Supplier
Frequently Asked Questions About 3.2mm, 20l Blind & Buried Vias Board from Shenzhen Hemeixin Electronics Co., Ltd.
FR-4 TG170 is a high-temperature epoxy resin system with a glass transition temperature (Tg) of 170°C, offering improved thermal stability for high-layer-count boards. This material is standard for applications requiring resistance to thermal stress, such as in telecommunications or industrial equipment.

Sourcing 3.2mm, 20l Blind & Buried Vias Board from Shenzhen Hemeixin Electronics Co., Ltd. - China Import Guide

Before ordering, buyers should verify the PCB’s layer stack-up and via configurations to ensure they meet the design requirements. Confirming the FR-4 TG170 material and ENIG finishing is also critical, as these directly impact thermal performance and solderability. Requesting a sample or prototype for validation is recommended for high-density designs.

Logistics details such as packaging, shipping methods, and Incoterms should be clarified with Shenzhen Hemeixin Electronics Co., Ltd. The supplier’s location in Shenzhen may offer advantages for shipping within Asia, but buyers should confirm lead times for their specific destination. Payment terms, including deposits and final payment schedules, should also be agreed upon in advance.

Quality checks should include electrical testing to validate continuity and isolation, as well as visual inspections for defects like voids or misaligned vias. Buyers may request documentation such as test reports or certificates of compliance with industry standards like IPC-A-600. For high-reliability applications, additional inspections or third-party testing may be necessary to ensure the PCB meets performance expectations.

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Shenzhen Hemeixin Electronics Co., Ltd.
China
Harbor
<4h
Response Time
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Response Rate
46/100
Trust Score
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Products
5(68)
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Buy & Import 3.2mm, 20l Blind&Buried V — Wholesale Supply from China

Securing a reliable supply chain for 3.2mm, 20l Blind&Buried Vias Board is critical for maintaining your business operations. Shenzhen Hemeixin Electronics Co., Ltd., a verified supplier located in China, provides high-quality 3.2mm, 20l Blind&Buried V ready for international export. By connecting directly with this supplier, buyers can bypass intermediaries, negotiate custom wholesale pricing, and arrange bulk shipments. This product is a key offering within the Products industry, catering to distributors, wholesalers, and importers worldwide.

Request Wholesale Pricing & Bulk Trade Terms

Navigating the complexities of global sourcing is easier when you have direct access to the right manufacturers and exporters. When importing 3.2mm, 20l Blind&Buried V from China, buyers can discuss shipping logistics, packaging requirements, and preferred payment terms directly with Shenzhen Hemeixin Electronics Co., Ltd.. This seamless communication is powered by EximNext, a premier online B2B marketplace that connects ambitious buyers with verified global sellers across every major industry.

About Shenzhen Hemeixin Electronics Co., Ltd. — Verified Supplier in China

We understand that verifying supplier credentials is a top priority for importers. Shenzhen Hemeixin Electronics Co., Ltd. is part of our extensive network of vetted international exporters. Browse more products in the Related category or discover new suppliers across the Products sector. Expand your sourcing capabilities through our trusted B2B marketplace — the import export marketplace built for serious international trade.

International Shipping & Import Guidelines for 3.2mm, 20l Blind&Buried V

When importing 3.2mm, 20l Blind&Buried V from China, buyers should consider shipping terms (FOB, CIF, EXW), customs documentation requirements, and payment security. Contact the supplier to discuss the best logistics options for your destination country.

Frequently Asked Questions About 3.2mm, 20l Blind&Buried V

How can I get the wholesale price for 3.2mm, 20l Blind&Buried Vias Board?

Click the "Request Quotation" button to contact Shenzhen Hemeixin Electronics Co., Ltd. directly. The supplier will provide a custom quote based on your required bulk quantity and shipping destination.

Can I buy 3.2mm, 20l Blind&Buried V in bulk from China?

Yes, Shenzhen Hemeixin Electronics Co., Ltd. provides 3.2mm, 20l Blind&Buried V for bulk export from China. You can negotiate the MOQ, packaging details, and shipping terms directly with the supplier.

What shipping terms are available for this product?

Shipping terms such as FOB, CIF, or EXW can be negotiated directly with Shenzhen Hemeixin Electronics Co., Ltd.. Contact the supplier to discuss the best logistics options for importing 3.2mm, 20l Blind&Buried V to your country.

How do I request a sample of 3.2mm, 20l Blind&Buried Vias Board?

Send a direct message to Shenzhen Hemeixin Electronics Co., Ltd. through our platform to request a product sample before committing to a large wholesale order.

Is it safe to source products from this supplier?

Shenzhen Hemeixin Electronics Co., Ltd. is a registered and verified supplier on EximNext. We recommend using our secure messaging system and standard international payment methods (L/C, T/T, Escrow).

What specifications should I ask for when importing 3.2mm, 20l Blind&Buried V?

Request a detailed product data sheet including grade, purity, dimensions, material composition, and applicable industry standards from Shenzhen Hemeixin Electronics Co., Ltd..

Does Shenzhen Hemeixin Electronics Co., Ltd. offer custom packaging or private labeling?

Many suppliers on EximNext, including Shenzhen Hemeixin Electronics Co., Ltd., offer custom packaging and private label options for bulk wholesale orders.

What payment methods are accepted for international orders?

Common payment methods include Letter of Credit (L/C), Telegraphic Transfer (T/T), Documents against Payment (D/P), and Escrow services.

Can I find more Products suppliers on EximNext?

Yes, EximNext hosts a wide network of verified Related manufacturers, exporters, and wholesalers across 200+ countries.

How do I contact Shenzhen Hemeixin Electronics Co., Ltd. for a bulk trade inquiry?

Click "Request Quotation" or "Contact Supplier" on this page. Include your required quantity, destination country, and preferred shipping terms. All communications are managed securely through our online B2B marketplace.

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