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The product is a diamond‑coated steel wire intended for precision slicing of silicon wafers used in photovoltaic and semiconductor production, featuring a high‑carbon steel core and electroplated diamond particles. It is supplied in diameters ranging from 0.08 mm to 0.35 mm and is suitable for wafers between 150 mm and 300 mm in size. The wire’s coating is described as compact, smooth and silver‑coloured, with uniformly distributed diamond particles that avoid agglomeration. The high‑carbon steel core delivers exceptional tensile strength and fatigue resistance, qualities that are critical when cutting brittle silicon. Diamond grit concentration can be customised for monocrystalline or polycrystalline silicon, a flexibility that matches the varied grain structures encountered in the industry. Typical diamond grit sizes fall between 5 µm and 15 µm, a range that balances cut quality with wear rate. Users such as PV module manufacturers and semiconductor wafer fabs rely on this wire to minimise kerf loss and maintain edge integrity. The supplier does not publish minimum order quantities, lead times or payment terms, so buyers should request those details directly. Confirmation of certification, test reports and packaging preferences is also required before finalising a purchase.
| Material | High carbon steel core with electroplated diamond particles |
| Core Diameter Range | 0.08 mm - 0.35 mm |
| Diamond Grit Concentration | Customisable to suit monocrystalline or polycrystalline silicon |
| Typical Tensile Strength | typical > 1500 MPa for high‑carbon steel core |
| Coating Type | Electroplated diamond coating, compact and smooth |
| Wire Appearance | Silver, smooth surface |
| Typical Wafer Compatibility | 150 mm - 300 mm silicon wafers |
| Typical Diamond Grit Size | typical 5 µm - 15 µm |
| Standard Packaging | typical coils or spools, 50 m per spool |
| MOQ | Not specified - confirm with supplier |
Henan Hengxing PC Steel Product Co., Ltd is based at No.299 Jinshui Road, Zhengzhou, Henan 450000, China. The supplier holds a harbour‑level verification tier, indicating that platform checks have validated its basic business credentials, although its response rate is recorded as 0.00 and average response time as 0 hours. The company states that it sources diamond‑coated wire from manufacturers across China, Japan and Taiwan, positioning itself as an intermediary for high‑precision cutting solutions. The listing emphasizes the ability to customise diamond grit concentration but does not disclose production capacity, pricing structure or lead‑time commitments.
Diamond coated steel wire is designed for precision slicing of silicon wafers used in semiconductor and solar PV manufacturing. The high-carbon steel core provides exceptional tensile strength and fatigue resistance, while uniformly distributed diamond particles ensure clean, kerf-loss-minimized cuts across 150mm to 300mm wafers. Widely sourced from manufacturers in China, Japan and Taiwan for export to photovoltaic and electronics manufacturing hubs. Available in standard diameters from 0.08mm to 0.35mm with customizable diamond grit concentration to suit monocrystalline or polycrystalline silicon cutting requirements.
| Business Type | Supplier |
| Year Established | Recently Joined |
| Employees | Contact Supplier |
| Annual Revenue | Contact Supplier |
| Main Products | View Products Tab |
| Major Markets | Global |
| Response Time | Contact Supplier |
| Response Rate | New Supplier |
Before placing an order, ask the supplier for a material test report that includes tensile strength, diamond grit distribution and coating adhesion data. Verify that the wire complies with any industry standards required by your plant, such as ISO 9001 or specific semiconductor clean‑room specifications. Request sample lengths if possible to evaluate cutting performance on your wafers.
Confirm the intended Incoterm - for example FOB Zhengzhou or CIF Shanghai - and ask for an estimated lead time based on the chosen diameter and custom grit concentration. Payment terms are not listed, so negotiate a suitable method such as T/T or documentary letter of credit. Clarify the exact packaging dimensions and weight per spool to calculate freight costs accurately.
Arrange a third‑party inspection at the supplier’s facility or upon arrival to check dimensions, coating integrity and tensile strength. Visual inspection for uniform diamond distribution and a surface roughness check are standard quality checkpoints. Ensure that the supplier can provide a certificate of conformity or any test certificates that your quality team requires before acceptance.
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When sourcing Slicing For Si Wafer Steel Wire for your business, securing the right balance of quality and cost is essential. Henan Hengxing PC Steel Product Co., Ltd, a verified supplier based in China, offers this product with key specifications including Diamond Wire for Si Wafer Slicing, High-Carbon Steel Wire Core, and 0.08mm - 0.35mm (Customizable). By purchasing directly from the manufacturer or authorized exporter, buyers can negotiate favorable FOB prices starting at $8,50014,000./Unit and manage bulk orders with a minimum order quantity (MOQ) of 1 Unit. This product is actively traded under HS Code 7226.99, making it a staple in the Steel Wires sector with strong demand from importing countries worldwide.
Importing Slicing For Si Wafer Stee requires careful attention to shipping logistics, customs compliance, and secure payment terms. Henan Hengxing PC Steel Product Co., Ltd offers flexible shipping options such as Full Container Load (FCL) or Less than Container Load (LCL) via sea freight. To ensure a smooth transaction, buyers should verify import duties for HS Code 7226.99 in their destination country. Common payment methods for international B2B transactions include Letter of Credit (L/C), Telegraphic Transfer (T/T), and Documents against Payment (D/P). All transactions and RFQs are facilitated through EximNext, a leading import export marketplace designed to make cross-border trade secure and efficient.
Finding trustworthy partners is the foundation of successful importing. The supplier of this Slicing For Si Wafer Stee has been verified on our platform. Whether you are a distributor, wholesaler, or procurement manager, you can request a free quotation, ask for product samples, and finalize your bulk purchase with confidence. EximNext hosts thousands of verified manufacturers and exporters across 200+ countries. Explore similar products in the Steel Wires category and connect with top-tier exporters on our comprehensive online B2B marketplace. Start your sourcing journey today.
Importing Slicing For Si Wafer Stee requires careful attention to shipping logistics, customs compliance, and secure payment terms. Common shipping options include Full Container Load (FCL) or Less than Container Load (LCL) via sea freight. Buyers should verify import duties for HS Code 7226.99 in their destination country. Common payment methods include Letter of Credit (L/C), Telegraphic Transfer (T/T), and Documents against Payment (D/P).
The current listed wholesale price for Slicing For Si Wafer Steel Wire from Henan Hengxing PC Steel Product Co., Ltd is $8,50014,000./Unit on FOB terms from China. Prices may vary depending on order volume, packaging, and destination. For the most accurate bulk quote, send a direct RFQ to Henan Hengxing PC Steel Product Co., Ltd through EximNext.
The supplier, Henan Hengxing PC Steel Product Co., Ltd, has set a Minimum Order Quantity (MOQ) of 1 Unit for Slicing For Si Wafer Stee. For sample requests or smaller trial orders, contact the supplier directly through our platform's inquiry system.
For international shipping and customs clearance, Slicing For Si Wafer Steel Wire is classified under HS Code 7226.99. Buyers should verify their local customs regulations to determine applicable import duties and taxes for this classification.
To import Slicing For Si Wafer Stee from China, negotiate shipping terms (FOB, CIF, or EXW) directly with Henan Hengxing PC Steel Product Co., Ltd. Ensure you have the necessary import licenses for Steel Wires products in your destination country.
Yes, Henan Hengxing PC Steel Product Co., Ltd is a verified supplier on EximNext. You can view their complete company profile, business registration details, certifications, and export history before placing a bulk order.
The key specifications for Slicing For Si Wafer Steel Wire supplied by Henan Hengxing PC Steel Product Co., Ltd include Diamond Wire for Si Wafer Slicing, High-Carbon Steel Wire Core, and 0.08mm - 0.35mm (Customizable). For a complete technical data sheet or Certificate of Analysis (COA), send an inquiry directly to the supplier through EximNext.
Henan Hengxing PC Steel Product Co., Ltd offers Slicing For Si Wafer Stee with standard export packaging. Custom packaging, private labeling, and OEM/ODM options may also be available for large wholesale orders.
Slicing For Si Wafer Stee is actively imported by buyers worldwide. Request a destination-specific CIF or CFR quote from Henan Hengxing PC Steel Product Co., Ltd through our platform.
Henan Hengxing PC Steel Product Co., Ltd maintains international quality certifications. These ensure that the Slicing For Si Wafer Stee meets international quality, safety, and regulatory standards required for cross-border trade.
Click "Request Quotation" on this product page, specify your required quantity, preferred shipping terms, and destination country. Henan Hengxing PC Steel Product Co., Ltd will respond with a detailed wholesale quote including FOB pricing, lead time, and payment options.
Common payment methods include Letter of Credit (L/C), Telegraphic Transfer (T/T), Documents against Payment (D/P), and Escrow services. Confirm accepted terms directly with Henan Hengxing PC Steel Product Co., Ltd.
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