Import 6-Layer Pcb With Osp Surface Finishing — Buy in Bulk from Supplier in China

The 6-layer PCB with OSP surface finishing from Xing Da Circuits Technology Co., Ltd. is a rigid multilayer board designed for high-density interconnect applications. It features a finished thickness range of 0.5 to 6.0 mm and is constructed using FR-4, CEM-1, CEM-3, or high-TG materials, with the option for halogen-free FR-4 to meet environmental standards. The board supports a maximum size of 450 mm by 500 mm for multilayer configurations.

OSP (Organic Solderability Preservative) surface finishing provides a flat, lead-free surface that is ideal for fine-pitch components and high-frequency applications. The PCB’s design accommodates minimum drilled hole sizes of 3 mil (0.075 mm), with minimum line width and spacing of 3 mil (0.075 mm). Copper thickness in holes exceeds 20.0 µm (1 mil), ensuring reliable electrical connectivity for complex circuits.

These PCBs are widely used in telecommunications, automotive electronics, and industrial control systems where space and performance are critical. Xing Da Circuits offers profiling options such as punching, routing, V-CUT, and beveling, with inner packaging in vacuum-sealed plastic bags and outer packaging in standard cartons. Buyers should confirm the board’s compatibility with their assembly processes, particularly for applications requiring controlled impedance or BGA packaging.

Xing Da Circuits Technology Co., Ltd. is based in Baoan District, Shenzhen, Guangdong, China, at 49th Building, New Zone, Dongfeng Village, Songguang Town. The company specializes in producing a broad selection of PCBs, including rigid, flex, and flex-rigid boards, as well as HDI and high-frequency PCBs, catering to industries with demanding interconnect requirements.

As an imported-tier supplier with a harbor trust tier, Xing Da Circuits demonstrates a baseline level of verification for PCB manufacturers in the region. The company’s capabilities include advanced features such as buried and blind vias, controlled impedance, and BGA compatibility, which are critical for high-performance applications. Buyers are encouraged to request samples or prototype runs to validate the supplier’s technical capabilities and quality standards.