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Construction & real estate›💡Electronic & Electrical›🍎Food & Beverages›🛋️Home furnishing & supplies›⚗️Industrial goods & chemical›🪨Minerals & metals›📦Miscellaneous›
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Construction & real estate›💡Electronic & Electrical›🍎Food & Beverages›🛋️Home furnishing & supplies›⚗️Industrial goods & chemical›🪨Minerals & metals›📦Miscellaneous›The item is a high‑density interconnect (HDI) board with a six‑layer stack comprising two flexible layers and four rigid layers, as supplied by Jinsung Electronics Co., Ltd. It is specified for semiconductor inspection equipment and has a total thickness of 0.5 mm. The board incorporates a minimum drilled via diameter of 0.25 mm and uses copper‑plated via fill with plated‑through‑hole (PTH) construction. BGA land dimensions are 0.3 mm with a pitch of 0.4 mm, and the surface finish is ENIG under a green solder mask.
The flexible layers typically employ polyimide substrates, while the rigid layers use standard FR‑4 prepreg, which is typical for HDI applications. Copper weight on each layer is commonly 18 µm (1 oz), providing reliable current carrying capacity. The ENIG finish offers good solderability and corrosion resistance, a standard choice for high‑frequency boards. Additional process steps such as PSR (photo‑sensitive resist) are applied to define fine traces and micro‑vias.
This board is favoured by contract manufacturers of semiconductor test rigs and OEMs requiring fine pitch interconnects, especially where controlled impedance of 50 Ω is needed. Buyers should request the full trade terms, including minimum order quantity and lead time, directly from Jinsung Electronics as these details are not disclosed in the listing. The supplier is based in Ansan‑Si, Gyeonggi‑Do, South Korea, and holds a harbor‑tier verification, which can be confirmed during the sourcing process.
| Layer configuration | 6‑layer stack: 2 flexible + 4 rigid |
| Total board thickness | 0.5 mm |
| Minimum drilled via diameter | 0.25 mm |
| Via construction | Copper‑plated, via fill + PTH |
| BGA land size | 0.3 mm |
| BGA pitch | 0.4 mm |
| Surface finish | ENIG (Electroless Nickel Immersion Gold) with green solder mask |
| Dielectric material (typical) | FR‑4 prepreg, typical for HDI |
| Copper weight per layer (typical) | 18 µm (1 oz) |
| Controlled impedance (typical) | 50 Ω microstrip |
Jinsung Electronics Co., Ltd is located at 16b 27l Banwol Ind Complex, 275‑10 Sinwon‑ro, Danwon‑gu, Ansan‑Si, Gyeonggi‑Do, South Korea. The supplier is classified as harbor‑tier, indicating basic verification on the platform, and its response rate is currently 0 %, with no recorded average response time.
The company lists HDI rigid‑flex boards designed for semiconductor inspection equipment, providing specifications such as a six‑layer stack, 0.5 mm thickness and ENIG surface treatment. The profile does not include details on production capacity, certifications or pricing, so interested importers should obtain those data directly from the supplier.
| 企业类型 | Supplier |
| 成立年份 | Contact Supplier |
| Employees | Contact Supplier |
| Annual Revenue | Contact Supplier |
| Main Products | View Products Tab |
| Major Markets | Global |
| 响应时间 | <4h |
| 响应率 | Contact Supplier |
Before placing an order, verify the supplier’s harbor‑tier status, confirm the exact corporate address in Ansan‑Si and request a detailed product datasheet that lists the layer stack, thickness and surface finish. Ask for a sample or test coupon to assess via dimensions and ENIG quality, and ensure that any required certifications such as IPC standards are available on request.
Logistics for HDI boards from South Korea typically involve FOB or CIF terms, but the specific Incoterm should be agreed with Jinsung Electronics. Lead times for six‑layer rigid‑flex boards can range from several weeks to a few months depending on volume; confirm the expected schedule and any tooling charges. Payment terms are usually negotiated per contract, with options such as T/T or LC, so clarify these details early in the negotiation.
Quality assurance should include visual inspection of the ENIG finish, measurement of via diameters and verification of the 0.5 mm thickness tolerance. Request test reports for copper weight, dielectric constant and impedance control, as well as any relevant IPC or ISO documentation. Arranging an independent third‑party inspection before shipment can further reduce risk of non‑conformance.
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When importing Hdi Rigid Flexible Manufa from South Korea (Republic Of Korea), buyers should consider shipping terms (FOB, CIF, EXW), customs documentation requirements, and payment security. Contact the supplier to discuss the best logistics options for your destination country.
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