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Construction & real estate›💡Electronic & Electrical›🍎Food & Beverages›🛋️Home furnishing & supplies›⚗️Industrial goods & chemical›🪨Minerals & metals›📦Miscellaneous›
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Construction & real estate›💡Electronic & Electrical›🍎Food & Beverages›🛋️Home furnishing & supplies›⚗️Industrial goods & chemical›🪨Minerals & metals›📦Miscellaneous›The BGA 572 test socket from Shenzhen Younrongda Micro Electronics Technology Co., Ltd. is a precision test fixture designed for computer, server system and set-top box mainboard CPU chip testing. It operates across an extreme temperature range from -40 degrees to +120 degrees Celsius, with bandwidth exceeding 4 GHz at -3 dB. The fixture accommodates manual and automatic test configurations through a unified design solution, using dowel pins for accurate top-lid-to-base alignment.
The socket body uses high-performance engineering materials rated for thermal cycling in semiconductor test environments. A double-buckle closure system incorporates a spin button with an internal plane thrust bearing to reduce operator fatigue and eliminate wear during repeated actuation. The fixed stroke distance protects both the probe tips and the device under test from over-travel damage. An anti-static plastic press plate prevents surface damage to IC packages during loading and test cycles.
This test socket targets semiconductor validation labs, contract electronics manufacturers and OEM mainboard producers that require reliable BGA device screening before system integration. The replaceable probe design supports maintenance schedules in high-volume production environments. Buyers should confirm array configurations and chip parameters with the supplier, as the product is customizable for different BGA types and pitches. Typical procurement involves discussing probe material specifications, expected contact cycles and warranty terms for the intended application.
| Bandwidth | >4 GHz @ -3 dB |
| Operating Temperature Range | -40 degrees C to +120 degrees C |
| Probe Contact Life | 50,000 insertions typical |
| Probe Tip Geometry | Crown shape, gold-plated surface |
| Actuation Mechanism | Double buckle with spin button, plane thrust bearing |
| Stroke Protection | Fixed stroke distance (standard design) |
| Press Plate Material | Anti-static plastic (typical) |
| Positioning Accuracy | Dowel pin alignment system |
| Probe Replaceability | Field-replaceable probes design |
| Warranty Period | 100 days free maintenance (standard) |
Shenzhen Younrongda Micro Electronics Technology Co., Ltd. operates from Zhongyuguan Industrial Park in Shenzhen, Guangdong Province, China. The supplier holds an imported tier classification with harbor trust status. Response metrics indicate a 0.00 percent response rate and zero average response hours, which suggests limited communication data is available for this profile. The company positions itself as a specialist in semiconductor test programming and BGA socket manufacturing for electronics testing applications.
The supplier's stated capabilities include customizable socket designs for varying chip arrays and parameters, with technical support and training offered as pre-sale services. Post-sale coverage includes 100 days of free maintenance excluding man-made damage, with continued repair available at material cost thereafter. The listing does not disclose factory size, annual output, certification holdings or named client references. Buyers should verify production capacity, quality management system registration and sample availability directly before committing to volume orders.
| 企业类型 | Supplier |
| 成立年份 | Contact Supplier |
| Employees | Contact Supplier |
| Annual Revenue | Contact Supplier |
| Main Products | View Products Tab |
| Major Markets | Global |
| 响应时间 | <4h |
| 响应率 | Contact Supplier |
Before ordering, verify the exact BGA pitch and ball count compatibility for your specific CPU or ASIC package. Request a mechanical sample or dimensional drawing to confirm dowel pin alignment with your PCB keep-out areas. Confirm that the probe force per ball meets your device manufacturer's maximum allowable compression specification, as excessive force can crack underfill in flip-chip packages. Ask for probe material certification and gold plating thickness to assess compatibility with your test environment and expected cycle count.
Logistics and lead time information is not stated in the listing data, so confirm directly with Shenzhen Younrongda whether standard configurations are stocked or built to order. Typical domestic Chinese manufacturing lead times for custom test fixtures range from two to six weeks depending on probe sourcing and array complexity. Clarify Incoterms, as EXW Shenzhen is common for specialized electronics tooling. Payment terms for initial orders from Chinese test fixture suppliers often require full TT advance or a 30/70 split; letter of credit may be accepted for larger recurring volumes. Request a proforma invoice specifying unit price, spare probe kit pricing, and freight cost to your destination.
Quality assurance should include incoming inspection of socket planarity using a granite surface plate and feeler gauges, as any warp will cause uneven probe contact across the BGA array. Verify that the supplier performs 100 percent electrical continuity and insulation resistance testing before shipment. Request a certificate of conformance with each lot, and if your application requires it, ask whether the engineering plastic formulation has UL flammability rating or RoHS compliance documentation. Consider engaging a third-party inspection service in Shenzhen for first-article approval before committing to production volume, particularly given the limited response data available for this supplier profile.
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