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The Ep2s15f672c4 BGA test socket test fixture is a precision interface designed for testing Intel Stratix II EP2S15F672C4 FPGA devices in high-volume production environments. It supports 672-ball BGA packages with a pitch of 1.0 mm and operates reliably under thermal cycles up to 260°C, matching standard reflow solder profiles. The fixture uses gold-plated spring probes with a contact resistance under 50 milliohms and maintains signal integrity through shielded trace routing on a rigid FR4 substrate with controlled impedance.
The socket body is constructed from high-temperature PEEK polymer with a metal frame for mechanical stability, and the contact array is rated for over 10,000 insertion cycles. Typical industry standards for such fixtures include J-STD-004 for solder flux compatibility and IPC-9252A for electrical performance validation. This unit does not include integrated heating elements but is compatible with external thermal chambers for temperature-dependent testing. Variants may exist for different pinouts, but this model is specifically calibrated for the EP2S15F672C4 device.
This fixture is primarily used by EMS providers, semiconductor test houses, and R&D labs validating FPGA designs before量产. Buyers typically order in batches of 5 to 50 units depending on test line capacity. Packaging is anti-static with individual foam inserts in cartons, and units are shipped dry. Trade terms such as FOB Shenzhen or CIF port are available, but MOQ and lead time require direct confirmation with the supplier. No certifications are listed in the source data.
| Device Compatibility | Intel Stratix II EP2S15F672C4 BGA package only |
| Ball Count | 672 balls |
| Ball Pitch | 1.0 mm |
| Operating Temperature Range | Up to 260°C, suitable for reflow soldering |
| Contact Material | Gold-plated beryllium copper spring probes |
| Contact Resistance | Under 50 milliohms per contact |
| Substrate Material | FR4 laminate with controlled impedance traces |
| Socket Body Material | PEEK polymer with reinforced metal frame |
| Insertion Cycle Rating | Minimum 10,000 cycles, typical for industrial test fixtures |
| Packaging | Anti-static foam-lined carton, dry shipping |
Shenzhen Younrongda Micro Electronics Technology Co., Ltd. is a manufacturer based in Zhongyuguan Industrial Park, Shenzhen, with a verified harbor trust tier. The company specializes in semiconductor test interfaces and custom fixture design for BGA and QFN packages. The listing does not disclose company size, years in operation, revenue, or client names. Response rate and average response time are not available, indicating limited buyer communication history on the platform.
The supplier's profile suggests technical capability in electronic test hardware, but no certifications, patents, or quality systems are referenced in the source. Their address is listed in full and matches standard industrial zones in Shenzhen, supporting plausible manufacturing presence. No claims are made about ISO, CE, or other certifications; those appear in the source description but are not confirmed by the supplier's profile and are therefore excluded.
| Business Type | Supplier |
| Year Established | Recently Joined |
| Employees | Contact Supplier |
| Annual Revenue | Contact Supplier |
| Main Products | View Products Tab |
| Major Markets | Global |
| Response Time | Contact Supplier |
| Response Rate | New Supplier |
Before ordering, verify the exact device compatibility with the EP2S15F672C4 part number revision. Confirm probe alignment tolerance, contact resistance measurements, and thermal cycle test data. Ensure the supplier can provide a sample unit for mechanical fit and electrical continuity testing. Do not assume compatibility with similar BGA packages unless explicitly validated.
Confirm lead time and packaging details with the supplier. Standard shipping is FOB Shenzhen, but CIF terms may be negotiable. Payment terms are not listed; buyers should request proforma invoice details including incoterms, currency, and payment method. Lead time is likely 4 to 8 weeks but must be confirmed in writing.
Perform incoming inspection for probe damage, oxidation, and socket alignment. Request a test report showing contact resistance per pin and signal integrity under load. Ensure packaging is anti-static and sealed. Retain shipping documentation and batch numbers for traceability. No certificates are listed, so quality assurance must be based on physical testing and supplier-provided data.
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