从China供应商批发进口2 In 1 Head Touch Screen Bga Rework Station — FOB条款

Shenzhen Dinghua Innovation Automation Co., Ltd. supplies the DH-A1L, a 2-in-1 head BGA rework station designed for repairing ICs, chipsets, and ball grid array components on motherboards found in laptops, mobile phones, PCs, iPhones, and gaming consoles. The system uses a three-heater configuration: a top hot air nozzle rated at 800W, a bottom heater combining 1200W hot air and 2800W infrared preheating, and a 90W soldering iron. It operates on AC 220V ±10% at 50/60 Hz and draws a total of 4900W.

The DH-A1L handles PCB sizes from 22 x 22 mm up to 500 x 400 mm, with BGA chip compatibility ranging from 2 x 2 mm to 80 x 80 mm and a minimum chip spacing of 0.15 mm. Temperature control uses a K-type thermocouple in a closed-loop system with ±2°C accuracy and independent heating zones. Positioning is managed via a V-groove with an adjustable PCB support and an external universal fixture, while additional features include a laser positioning system, vacuum pick-up and place, an integrated smart PC for auto-profiling, and a cooling fan.

The station is aimed at electronics repair workshops, OEM service centres, and PCB rework facilities that need precise, repeatable BGA desoldering and reballing. Its 45 kg net weight and 640 x 730 x 580 mm footprint place it in the mid-range benchtop category. Buyers should contact Shenzhen Dinghua Innovation Automation directly to confirm pricing, MOQ, lead time, and whether an external temperature sensor (listed as optional) is included or available separately.

Shenzhen Dinghua Innovation Automation Co., Ltd. is located on the 4th Floor, Block 6B, Shengzuozhi Industrial Park, Shenzhen 518000, China. The supplier holds a 'harbor' trust tier on the platform, though the response rate is recorded at 0.00 and average response time is not available. The listing does not disclose the company's founding year, number of employees, annual revenue, or export history.

The product page is focused on the DH-A1L BGA rework station and provides detailed technical specifications, feature descriptions, and information on BGA packaging materials. It does not mention other products in the supplier's catalogue, manufacturing capabilities, or after-sales support arrangements. Buyers should request a full company profile, references from existing customers, and details on warranty and technical support before committing to a purchase.