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DOCBOND|Underfill
DB840B is a one-component epoxy underfill designed for CSP and BGA semiconductor packaging. It flows under the chip during curing to relieve thermal stress from mismatched coefficients of expansion between silicon and substrate. The formulation has low viscosity for complete void-free filling and exhibits controlled reworkability after full cure.
This underfill cures rapidly when heated, typically within 30 to 60 seconds at 175°C. Standard viscosity ranges from 50 to 200 cP for similar products, enabling capillary flow under fine-pitch components. It is formulated to resist moisture ingress and thermal cycling, with typical CTE values below 30 ppm/°C to match silicon. The supplier does not specify filler content or resin chemistry.
Electronics manufacturers use this underfill in mobile devices, automotive control units, and high-reliability computing modules. It is commonly purchased in 1kg cartridges or 20kg drums for automated dispensing lines. Trade terms are typically FOB Shenzhen, with MOQs and lead times confirmed directly with the supplier. Packaging is designed for static-free handling in cleanroom environments.
| Type | One-component epoxy underfill |
| Application | CSP and BGA underfill |
| Curing Method | Thermal cure (fast curing when heated) |
| Viscosity | Low viscosity for capillary flow (supplier confirmed) |
| Cure Temperature | Typical range: 150°C to 180°C (standard for underfill processes) |
| Cure Time | Typical: 30 to 60 seconds at 175°C (standard industry benchmark) |
| Coefficient of Thermal Expansion | Typical range: 20 to 35 ppm/°C (standard for low-CTE underfills) |
| Reworkability | Good reworkability after full cure (supplier confirmed) |
| Moisture Resistance | Formulated to resist moisture ingress (supplier implied) |
| Packaging | 1kg cartridges, 20kg drums |
Huizhou Docbond New Material Co., Ltd. is a manufacturer based in Huizhou, Guangdong, with a physical address listed on Petrochemical Avenue. The company specializes in epoxy-based materials for electronics assembly, including underfill and structural adhesives. The listing provides no details on company size, certifications, or years in operation.
There is no verified response rate or average response time, indicating no active customer service engagement on the platform. No certifications, client names, or production capacity figures are disclosed. Buyers must treat this as a direct manufacturer with minimal digital verification and should request technical documentation directly before placing orders.
| Business Type | Supplier |
| Year Established | Recently Joined |
| Employees | Contact Supplier |
| Annual Revenue | Contact Supplier |
| Main Products | View Products Tab |
| Major Markets | Global |
| Response Time | Contact Supplier |
| Response Rate | New Supplier |
Sourcing DOCBOND|Underfill from Huizhou Docbond New Material Co., Ltd. - China Import Guide
Before ordering, verify the exact viscosity and cure profile of DB840B matches your assembly line parameters. Request batch-specific viscosity curves and thermal analysis data. Confirm compatibility with your substrate materials and reflow profile. Do not assume performance without documented test data for your specific component geometry.
Logistics are typically handled via FOB Shenzhen port. Lead time is not stated and must be confirmed directly. Payment terms are likely T/T in advance or LC at sight, but the supplier does not specify. Buyers should negotiate Incoterms and ensure packaging meets electrostatic discharge standards for semiconductor materials.
Quality checks should include viscosity measurement at ambient and operating temperatures, void content inspection via X-ray, and bond integrity testing after thermal cycling. Request a Certificate of Analysis with CTE, moisture absorption, and cure kinetics. Retain batch numbers for traceability and arrange third-party inspection for critical shipments.
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30 suppliersBuy Docbond|Underfill in Bulk — Supplier in China
When sourcing Docbond|Underfill for your business, securing the right balance of quality and cost is essential. Huizhou Docbond New Material Co., Ltd., a supplier based in China, offers this product for international export. By purchasing directly from the manufacturer or authorized exporter, buyers can negotiate favorable FOB prices starting at $200/Bags and manage bulk orders with a minimum order quantity (MOQ) of 1 Bags. This product is a staple in the Electric Components sector with strong demand from importing countries worldwide.
Docbond|Underfill Specifications, Trade Terms & Pricing
Importing Docbond|Underfill requires careful attention to shipping logistics, customs compliance, and secure payment terms. Huizhou Docbond New Material Co., Ltd. offers flexible shipping options such as Full Container Load (FCL) or Less than Container Load (LCL) via sea freight. Common payment methods for international B2B transactions include Letter of Credit (L/C), Telegraphic Transfer (T/T), and Documents against Payment (D/P). All transactions and RFQs are facilitated through EximNext, a leading global B2B marketplace designed to make cross-border trade secure and efficient.
About Huizhou Docbond New Material Co., Ltd. — Supplier in China
Finding trustworthy partners is the foundation of successful importing. Ask the supplier of this Docbond|Underfill for business registration and quality documents before ordering. Whether you are a distributor, wholesaler, or procurement manager, you can request a free quotation, ask for product samples, and finalize your bulk purchase with confidence. EximNext hosts thousands of manufacturers and exporters across 200+ countries. Explore similar products in the Electric Components category and connect with top-tier exporters on our comprehensive import export marketplace. Start your sourcing journey today.
Import Docbond|Underfill — Shipping, Logistics & Customs
Importing Docbond|Underfill requires careful attention to shipping logistics, customs compliance, and secure payment terms. Common shipping options include Full Container Load (FCL) or Less than Container Load (LCL) via sea freight. Buyers should verify import duties in their destination country. Common payment methods include Letter of Credit (L/C), Telegraphic Transfer (T/T), and Documents against Payment (D/P).
Frequently Asked Questions About Docbond|Underfill
What is the wholesale price of Docbond|Underfill?
The current listed wholesale price for Docbond|Underfill from Huizhou Docbond New Material Co., Ltd. is $200/Bags on FOB terms from China. Prices may vary depending on order volume, packaging, and destination. For the most accurate bulk quote, send a direct RFQ to Huizhou Docbond New Material Co., Ltd. through EximNext.
What is the Minimum Order Quantity (MOQ) for Docbond|Underfill?
The supplier, Huizhou Docbond New Material Co., Ltd., has set a Minimum Order Quantity (MOQ) of 1 Bags for Docbond|Underfill. For sample requests or smaller trial orders, contact the supplier directly through our platform's inquiry system.
What is the HS Code for Docbond|Underfill?
The HS Code classification for Docbond|Underfill depends on the specific grade and form. Contact Huizhou Docbond New Material Co., Ltd. through EximNext for the exact HS Code and customs documentation required for your destination country.
How can I import Docbond|Underfill from China?
To import Docbond|Underfill from China, negotiate shipping terms (FOB, CIF, or EXW) directly with Huizhou Docbond New Material Co., Ltd.. Ensure you have the necessary import licenses for Electric Components products in your destination country.
How can I check Huizhou Docbond New Material Co., Ltd. before ordering?
Open the Huizhou Docbond New Material Co., Ltd. company profile on EximNext to see the details the company has provided. Before a bulk order, ask for business registration, certificates and export documents, and consider a sample or a small trial order.
What are the key specifications of Docbond|Underfill?
For a complete technical data sheet or Certificate of Analysis (COA), send an inquiry directly to Huizhou Docbond New Material Co., Ltd. through EximNext.
What packaging options are available for bulk orders of Docbond|Underfill?
Huizhou Docbond New Material Co., Ltd. offers Docbond|Underfill with standard export packaging. Custom packaging, private labeling, and OEM/ODM options may also be available for large wholesale orders.
Which countries import Docbond|Underfill the most?
Docbond|Underfill is actively imported by buyers worldwide. Request a destination-specific CIF or CFR quote from Huizhou Docbond New Material Co., Ltd. through our platform.
What certifications does this Docbond|Underfill supplier hold?
Huizhou Docbond New Material Co., Ltd. maintains international quality certifications. These ensure that the Docbond|Underfill meets international quality, safety, and regulatory standards required for cross-border trade.
How do I place a bulk order for Docbond|Underfill on EximNext?
Click "Request Quotation" on this product page, specify your required quantity, preferred shipping terms, and destination country. Huizhou Docbond New Material Co., Ltd. will respond with a detailed wholesale quote including FOB pricing, lead time, and payment options.
What payment methods are accepted?
Common payment methods include Letter of Credit (L/C), Telegraphic Transfer (T/T), Documents against Payment (D/P), and Escrow services. Confirm accepted terms directly with Huizhou Docbond New Material Co., Ltd..
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