Huizhou Docbond New Material Co., Ltd.

Based in Huizhou, China, Huizhou Docbond New Material Co., Ltd. lists eight active products across the categories of glues & adhesives, industrial chemicals, silicon sealants, graphite, and electric components. The catalogue includes a microporous plugging agent, a UV‑cure liquid sealant, connector waterproof glue, underfill, in‑mold injection adhesive, two‑component structural adhesive, high thermal conductivity epoxy adhesive, and a graphite preform plate that is classified under HS code 3801.30 and is specified as flexible graphite with a minimum of 99 % carbon content.

The product set covers typical HS‑code families for these materials: adhesives generally fall under HS 3506, sealants under HS 3808, epoxy adhesives under HS 3507, and graphite products under HS 3801. Each item is described by its functional class rather than a brand name, allowing buyers to match technical specifications such as shear strength, cure time, or thermal conductivity to the appropriate product type.

The catalogue offers a microporous plugging agent designed for sealing micro‑voids in composite structures, a UV‑cure liquid sealant that cures within seconds under UV light, and a connector waterproof glue formulated for electronic assemblies. Underfill and in‑mold injection adhesives are used to fill gaps during molding processes, while the two‑component structural adhesive provides high shear strength for load‑bearing joints. The high thermal conductivity epoxy adhesive is specified for heat‑dissipating applications, and the graphite preform plate supplies flexible conductive paths in high‑temperature environments. In the broader market, UV‑cure sealants are typically supplied in viscosity ranges of 200 - 500 cP and cure within 10 - 30 seconds, structural adhesives are often rated to 20 - 30 MPa shear strength, and epoxy adhesives for thermal management commonly exhibit thermal conductivity of 1.0 - 2.5 W/m·K.