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Construction & real estate›💡Electronic & Electrical›🍎Food & Beverages›🛋️Home furnishing & supplies›⚗️Industrial goods & chemical›🪨Minerals & metals›📦Miscellaneous›
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Construction & real estate›💡Electronic & Electrical›🍎Food & Beverages›🛋️Home furnishing & supplies›⚗️Industrial goods & chemical›🪨Minerals & metals›📦Miscellaneous›The 8L PCB from Shenzhen X-mulong Circuits Co., Ltd targets high-density interconnection requirements across consumer, industrial, and telecommunications sectors. The source description highlights RoHS-compliant materials and customisable sizes, though no fixed dimensions, thickness, or substrate material grade are specified. Eight layers support complex routing while maintaining signal integrity in space-constrained designs. The supplier operates from an facility in Yanchuan Industrial Area, Shenzhen, Guangdong.
The thermal conductivity emphasis in the source suggests the supplier positions this board for applications where heat dissipation matters, such as power electronics or enclosed industrial controllers. Without stated laminate type, typical 8-layer constructions use FR-4 of various Tg ratings, or alternative materials like high-Tg FR-4, polyimide, or metal-backed substrates for enhanced thermal performance. The RoHS compliance claim should be verified with specific directive references (2011/65/EU as amended) and test reports for cadmium, lead, mercury, and hexavalent chromium limits. Customisable sizes imply panelisation flexibility, but maximum panel dimensions and available copper weights need confirmation.
Buyers in automotive electronics, industrial automation, and telecommunications infrastructure form the core market. The absence of stated minimum hole size, line width, or impedance control specifications means engineering review is essential before design release. The supplier's description mentions flexible minimum order quantities without quantifying them. Direct negotiation on prototype quantities, panel utilisation, and whether NRE charges apply for custom tooled designs is necessary. The source also references ISO and SGS certifications without specifics, so buyers should request current certificates and verify scope.
| Layer Count | 8 layers |
| Material Compliance | RoHS compliant (supplier claim; confirm directive and test report) |
| Interconnect Technology | High-density interconnections (supplier claim; confirm minimum pad pitch and via type) |
| Thermal Management | Enhanced thermal conductivity (supplier claim; confirm material and thermal conductivity value in W/m·K) |
| Design Flexibility | Customisable sizes and configurations (confirm maximum panel size and copper weight range) |
| Substrate Material (typical industry) | FR-4, high-Tg FR-4, or polyimide for standard 8-layer boards; metal-backed for thermal applications |
| Glass Transition Temperature (typical) | 140-170°C for standard FR-4; 180°C+ for high-Tg variants (standard industry range) |
| Copper Weight (typical range) | 0.5 oz to 3 oz (17 μm to 105 μm) per layer, with heavier copper on outer layers possible |
| Minimum Hole Size (typical industry) | 0.20-0.30 mm for mechanical drill; 0.10 mm for laser drill (standard capability range) |
| Impedance Control (typical industry) | ±10% tolerance with controlled dielectric spacing (standard); ±5% with advanced processes |
Shenzhen X-mulong Circuits Co., Ltd is located at A4 Building, 2nd Floor, North of Yanchuan Industrial Area, Shenzhen, Guangdong 523875. The supplier tier is 'imported' with a 'harbor' trust tier, and no response rate or response time data is recorded. This absence of engagement metrics means buyers should initiate contact early to assess communication quality and English-language engineering support.
The source description references ISO and SGS certifications without certificate numbers, dates, or accredited scopes. SGS is a testing and certification body, not a standard itself, so buyers should clarify whether this refers to SGS-authored RoHS test reports, ISO 9001 quality system certification, or other specific programmes. No factory size, equipment list, or production capacity is disclosed. The supplier's emphasis on customisable designs suggests a build-to-order model, but this should be confirmed through direct enquiry and, where possible, a factory audit or virtual tour.
| 企业类型 | Supplier |
| 成立年份 | Contact Supplier |
| Employees | Contact Supplier |
| Annual Revenue | Contact Supplier |
| Main Products | View Products Tab |
| Major Markets | Global |
| 响应时间 | <4h |
| 响应率 | Contact Supplier |
Before committing to Shenzhen X-mulong Circuits Co., Ltd, request a qualification build of 5-10 pieces with full process documentation including drill files, plating records, and cross-sectional micrographs. Verify their RoHS compliance with dated third-party test reports, not supplier declarations alone. Check that their quality system includes incoming material inspection, in-process AOI for inner layers, and final outgoing inspection against IPC-A-600 or IPC-A-610 as appropriate. If your design includes controlled impedance, demand measurement data from test coupons and compare against your simulation. The lack of response rate data in their profile means you should establish a direct communication channel, preferably with a named engineering contact, before finalising specifications.
For shipping and payment, clarify Incoterms early. FOB Yantian or CIF destination are common from Shenzhen; DDP may be available through their freight forwarder but adds cost and complexity. Typical payment structures for new relationships are 30% deposit, 70% against copy of bill of lading, or 100% advance for small prototype orders. Letters of credit are less common for low-value PCB orders due to cost. Ask whether they can deliver to a Hong Kong logistics hub for consolidation with other Chinese suppliers, reducing per-shipment freight overheads. Confirm packaging: typical PCB packaging uses vacuum-sealed bags with desiccant and humidity indicator cards; specify anti-static requirements if handling sensitive components.
Quality verification on arrival should include dimensional checks against your Gerber data, not just supplier drawings. Use cross-sectioning to verify layer count, copper thickness per layer, and dielectric spacing. For thermal applications, consider thermal cycling tests per IPC-TM-650 method 2.6.7 or your industry's equivalent. If the material grade was specified in the order, verify laminate branding and lot numbers against certificates. Document any solderability issues, delamination, or dimensional non-conformance photographically and notify the supplier within any stated claim period. For ongoing supply, consider annual factory audits or use of a third-party inspection service based in Shenzhen to conduct pre-shipment checks without your physical presence.
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