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GLPOLY thermal pad is featuring a high thermal conductivity of 6.0W/mK, its higher than that of most of competitor. Comparing with Bergquist gap pad 5000S35, the data will shows that GLPOLY thermal gap filler pad can perfectly replace the BQ 5000S35. Firstly, the thermal conductivity of GLPOLY thermal gap filler pad is higher that that of BQ 5000S35; the thermal resistance is only 0.16in2/W, its just one third of BQ 5000S35. Comparison data reflects that GLPOLY thermal gap filler pad offers more excellent thermal performance than BQ5000S35. For the electrical property, the dielectric breakdown voltage is 16KV, its 3 times greater than BQ 5000S35s. this will ensure the stability of performance of devices. The material yields extremely soft characteristics while maintaining elasticity and conformability. Conforms to demanding contours and maintains structural integrity with little or no stress applied to fragile components. The inherent natural tack on both sides assists in application and allows the products to effectively fill gaps, reducing thermal resistance and enhancing the overall thermal performance. GLPOLY thermal gap filler pad is ideal for high-performance application at low stress or pressure. Features Ultra conformability Designed for low-stress applications Fiberglass reinforced for puncture, shear and tear resistance ThicknessMm---- 0.3~5.0 Densityg/cm3---- 2.6 ,HardnessShore 00--20,20 Thermal Conductivity W/m*K--2.0,2.8
| HS Code | 4002.19 |
| Material | Silicone Elastomer Thermal Interface Material, Ceramic-Filled Polymer Composite |
| Thermal Conductivity | 6.0 W/mK |
| Thickness | 0.5mm - 5.0mm (customizable) |
| Hardness (Shore 00) | 35 Shore 00 |
| Dielectric Strength | >5 kV/mm |
| Volume Resistivity | 1.0 x 10^13 ohm-cm |
| Temperature Range | -60°C to +200°C |
| Size/Sheet Dimensions | Standard sheet 200mm x 300mm, or custom die-cut shapes |
| Application | Power modules, LED lighting, automotive electronics, telecommunications, CPU/GPU cooling |
| Origin | China (GLPOLY Brand) / Comparable to Bergquist 5000S35 (USA origin) |
This thermal gap pad is a high-performance thermal interface material (TIM) designed for heat dissipation in electronics, LED modules, power semiconductors, and automotive ECUs. With a thermal conductivity of 6.0W/mK, it is engineered as a direct alternative to Bergquist Gap Pad 5000S35, offering excellent compressibility and dielectric strength for reliable thermal management in import/export trade circuits and assemblies.
| Business Type | Supplier |
| Year Established | Recently Joined |
| Employees | Contact Supplier |
| Annual Revenue | Contact Supplier |
| Main Products | View Products Tab |
| Major Markets | Global |
| Response Time | <4h |
| Response Rate | New Supplier |
Thermal Gap Pad Vs Bergquist Gap Pad 5000s35 is offered by Shenzhen Goldlink Tongda Electronics Co., Ltd., a Supplier based in China, in wholesale quantities for importers, distributors, and trade buyers. Contact the supplier to request pricing, minimum order quantity, and shipping terms for your destination.
When importing Thermal Gap Pad Vs Bergqu, confirm trade terms such as FOB or CIF, packaging, and any certification or documentation you need directly with the supplier before placing a bulk order.
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When sourcing Thermal Gap Pad Vs Bergquist Gap Pad 5000s35 for your business, securing the right balance of quality and cost is essential. Shenzhen Goldlink Tongda Electronics Co., Ltd., a verified supplier based in China, offers this product with key specifications including 6.0 W/mK, 0.5mm - 5.0mm (customizable), and 35 Shore 00. By purchasing directly from the manufacturer or authorized exporter, buyers can negotiate favorable FOB prices starting at $1.8/Bags and manage bulk orders with a minimum order quantity (MOQ) of 1 Bags. This product is actively traded under HS Code 4002.19, making it a staple in the Electric Components sector with strong demand from importing countries worldwide.
Importing Thermal Gap Pad Vs Bergqu requires careful attention to shipping logistics, customs compliance, and secure payment terms. Shenzhen Goldlink Tongda Electronics Co., Ltd. offers flexible shipping options such as Full Container Load (FCL) or Less than Container Load (LCL) via sea freight. To ensure a smooth transaction, buyers should verify import duties for HS Code 4002.19 in their destination country. Common payment methods for international B2B transactions include Letter of Credit (L/C), Telegraphic Transfer (T/T), and Documents against Payment (D/P). All transactions and RFQs are facilitated through EximNext, a leading online B2B marketplace designed to make cross-border trade secure and efficient.
Finding trustworthy partners is the foundation of successful importing. The supplier of this Thermal Gap Pad Vs Bergqu has been verified on our platform. Whether you are a distributor, wholesaler, or procurement manager, you can request a free quotation, ask for product samples, and finalize your bulk purchase with confidence. EximNext hosts thousands of verified manufacturers and exporters across 200+ countries. Explore similar products in the Electric Components category and connect with top-tier exporters on our comprehensive B2B marketplace. Start your sourcing journey today.
Importing Thermal Gap Pad Vs Bergqu requires careful attention to shipping logistics, customs compliance, and secure payment terms. Common shipping options include Full Container Load (FCL) or Less than Container Load (LCL) via sea freight. Buyers should verify import duties for HS Code 4002.19 in their destination country. Common payment methods include Letter of Credit (L/C), Telegraphic Transfer (T/T), and Documents against Payment (D/P).
The current listed wholesale price for Thermal Gap Pad Vs Bergquist Gap Pad 5000s35 from Shenzhen Goldlink Tongda Electronics Co., Ltd. is $1.8/Bags on FOB terms from China. Prices may vary depending on order volume, packaging, and destination. For the most accurate bulk quote, send a direct RFQ to Shenzhen Goldlink Tongda Electronics Co., Ltd. through EximNext.
The supplier, Shenzhen Goldlink Tongda Electronics Co., Ltd., has set a Minimum Order Quantity (MOQ) of 1 Bags for Thermal Gap Pad Vs Bergqu. For sample requests or smaller trial orders, contact the supplier directly through our platform's inquiry system.
For international shipping and customs clearance, Thermal Gap Pad Vs Bergquist Gap Pad 5000s35 is classified under HS Code 4002.19. Buyers should verify their local customs regulations to determine applicable import duties and taxes for this classification.
To import Thermal Gap Pad Vs Bergqu from China, negotiate shipping terms (FOB, CIF, or EXW) directly with Shenzhen Goldlink Tongda Electronics Co., Ltd.. Ensure you have the necessary import licenses for Electric Components products in your destination country.
Yes, Shenzhen Goldlink Tongda Electronics Co., Ltd. is a verified supplier on EximNext. You can view their complete company profile, business registration details, certifications, and export history before placing a bulk order.
The key specifications for Thermal Gap Pad Vs Bergquist Gap Pad 5000s35 supplied by Shenzhen Goldlink Tongda Electronics Co., Ltd. include 6.0 W/mK, 0.5mm - 5.0mm (customizable), and 35 Shore 00. For a complete technical data sheet or Certificate of Analysis (COA), send an inquiry directly to the supplier through EximNext.
Shenzhen Goldlink Tongda Electronics Co., Ltd. offers Thermal Gap Pad Vs Bergqu with standard export packaging. Custom packaging, private labeling, and OEM/ODM options may also be available for large wholesale orders.
Thermal Gap Pad Vs Bergqu is actively imported by buyers worldwide. Request a destination-specific CIF or CFR quote from Shenzhen Goldlink Tongda Electronics Co., Ltd. through our platform.
Shenzhen Goldlink Tongda Electronics Co., Ltd. maintains international quality certifications. These ensure that the Thermal Gap Pad Vs Bergqu meets international quality, safety, and regulatory standards required for cross-border trade.
Click "Request Quotation" on this product page, specify your required quantity, preferred shipping terms, and destination country. Shenzhen Goldlink Tongda Electronics Co., Ltd. will respond with a detailed wholesale quote including FOB pricing, lead time, and payment options.
Common payment methods include Letter of Credit (L/C), Telegraphic Transfer (T/T), Documents against Payment (D/P), and Escrow services. Confirm accepted terms directly with Shenzhen Goldlink Tongda Electronics Co., Ltd..
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