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The eMMC eMCP Socket USB SD Interface is a test socket designed for programming and functional verification of eMMC and eMCP devices. It features a high‑dielectric polymer housing, beryllium‑copper contact pins and gold‑plated contacts to ensure reliable electrical performance. The socket supports multiple BGA footprints, including BGA153, BGA169, BGA162, BGA186 and BGA221, with pin counts of 30, 17 or 36 depending on the version. The pin pitch is 0.5 mm, matching common industry standards for high‑density packages.
The housing material provides insulation while the gold‑plated contacts reduce oxidation and maintain low contact resistance. The design is rated for 25 000 mating cycles, which is typical for test sockets used in high‑volume production environments. Typical operating temperature ranges from - 40 °C to 85 °C, and the socket conforms to JEDEC JESD22‑A101 mechanical testing standards for durability. A USB interface allows direct connection to a PC, and supplied software can perform capacity checks, read, write and verification functions.
Customers such as smartphone OEMs, tablet manufacturers and IoT device assemblers use this socket for device validation, failure analysis and prototype testing. The product is offered in a kit that includes the socket, a PCB test board with USB connector and border limiters for various IC sizes. As the listing does not disclose minimum order quantity, lead time or pricing, prospective buyers should contact Shenzhen Hongyi Electronic Technology Co., Ltd. for those commercial details.
| Housing material | High‑dielectric polymer |
| Contact pin material | Beryllium copper, gold‑plated |
| Pin pitch | 0.5 mm |
| Supported BGA footprints | BGA153, BGA169, BGA162, BGA186, BGA221 |
| Pin count | 30 pins (BGA153/169), 17 pins (BGA162/186), 36 pins (BGA221) |
| Applicable IC size | 11.5 mm × 13 mm to 14 mm × 18 mm |
| Rated life span | 25 000 mating cycles |
| Typical operating temperature | - 40 °C to 85 °C (typical) |
| Typical compliance | JEDEC JESD22‑A101 mechanical test (standard) |
Shenzhen Hongyi Electronic Technology Co., Ltd. is headquartered at No.14Th, Rentian Road, Fuyong Street, Shenzhen, Guangdong, 518000, China. The supplier is placed in the harbour trust tier, indicating a basic verification level on the platform. Its public response statistics show a response rate of 0 % and no average response time has been recorded. The company lists electronic testing components as its primary offering.
The eMMC eMCP Socket listing provides detailed technical specifications but does not mention any certifications such as ISO 9001 or RoHS compliance. Potential buyers should request confirmation of any required quality or environmental certifications directly from the supplier. No information on minimum order quantity, lead time or after‑sales support is provided, so these commercial terms need to be clarified before committing to a purchase.
This BGA test socket supports eMMC and eMCP chips from Samsung, Sandisk, Toshiba, Hynix, Micron, MTK and Intel across multiple BGA footprints including BGA153, BGA169, BGA162, BGA186 and BGA221. Designed for electronics manufacturing and quality inspection, the socket provides a USB interface for programming and functional testing. Ideal for IC verification in smartphone, tablet and embedded system production lines, serving both OEM manufacturers and EMS providers engaged in import and export of consumer electronics components.
| Business Type | Supplier |
| Year Established | Recently Joined |
| Employees | Contact Supplier |
| Annual Revenue | Contact Supplier |
| Main Products | View Products Tab |
| Major Markets | Global |
| Response Time | <4h |
| Response Rate | New Supplier |
Importers should first verify that the socket’s supported BGA footprints, pin pitch and contact material meet the specifications of the devices under test. Request a datasheet that confirms the 0.5 mm pitch and the gold‑plated beryllium‑copper contacts, and ask whether the supplier can provide a certificate of conformity to JEDEC JESD22‑A101 if required for quality audits.
Logistics planning requires clarification of production lead time, shipping incoterms and payment schedule, none of which are disclosed in the listing. Typical arrangements with Chinese component manufacturers involve FOB Shanghai or CIF destination, with a 30 % T/T deposit before production and the balance on sight or upon document presentation. Confirm the preferred incoterm and the supplier’s accepted payment methods before finalising the order.
Quality control should include a visual inspection of the socket housing for cracks, verification of pin alignment and a functional test using the supplied USB software. Request a test report that documents the 25 000‑cycle life claim and the operating temperature range. Ensure that the supplier provides a complete set of documentation, including a user manual, safety data sheet and any applicable certification copies.
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When sourcing Emmc Emcp Socket Usb Sd Interface for your business, securing the right balance of quality and cost is essential. Shenzhen Hongyi Electronic Technology Co., Ltd., a verified supplier based in China, offers this product with key specifications including BGA Test Socket for eMMC/eMCP Chips, BGA153, BGA162, BGA169, BGA186, BGA221, and Samsung, Sandisk, Toshiba, Hynix, Micron, MTK, Intel. By purchasing directly from the manufacturer or authorized exporter, buyers can negotiate favorable FOB prices starting at $280/Bags and manage bulk orders with a minimum order quantity (MOQ) of 1 Bags. This product is actively traded under HS Code 8486.20, making it a staple in the Electric Components sector with strong demand from importing countries worldwide.
Importing Emmc Emcp Socket Usb Sd I requires careful attention to shipping logistics, customs compliance, and secure payment terms. Shenzhen Hongyi Electronic Technology Co., Ltd. offers flexible shipping options such as Full Container Load (FCL) or Less than Container Load (LCL) via sea freight. To ensure a smooth transaction, buyers should verify import duties for HS Code 8486.20 in their destination country. Common payment methods for international B2B transactions include Letter of Credit (L/C), Telegraphic Transfer (T/T), and Documents against Payment (D/P). All transactions and RFQs are facilitated through EximNext, a leading online B2B marketplace designed to make cross-border trade secure and efficient.
Finding trustworthy partners is the foundation of successful importing. The supplier of this Emmc Emcp Socket Usb Sd I has been verified on our platform. Whether you are a distributor, wholesaler, or procurement manager, you can request a free quotation, ask for product samples, and finalize your bulk purchase with confidence. EximNext hosts thousands of verified manufacturers and exporters across 200+ countries. Explore similar products in the Electric Components category and connect with top-tier exporters on our comprehensive B2B marketplace. Start your sourcing journey today.
Importing Emmc Emcp Socket Usb Sd I requires careful attention to shipping logistics, customs compliance, and secure payment terms. Common shipping options include Full Container Load (FCL) or Less than Container Load (LCL) via sea freight. Buyers should verify import duties for HS Code 8486.20 in their destination country. Common payment methods include Letter of Credit (L/C), Telegraphic Transfer (T/T), and Documents against Payment (D/P).
The current listed wholesale price for Emmc Emcp Socket Usb Sd Interface from Shenzhen Hongyi Electronic Technology Co., Ltd. is $280/Bags on FOB terms from China. Prices may vary depending on order volume, packaging, and destination. For the most accurate bulk quote, send a direct RFQ to Shenzhen Hongyi Electronic Technology Co., Ltd. through EximNext.
The supplier, Shenzhen Hongyi Electronic Technology Co., Ltd., has set a Minimum Order Quantity (MOQ) of 1 Bags for Emmc Emcp Socket Usb Sd I. For sample requests or smaller trial orders, contact the supplier directly through our platform's inquiry system.
For international shipping and customs clearance, Emmc Emcp Socket Usb Sd Interface is classified under HS Code 8486.20. Buyers should verify their local customs regulations to determine applicable import duties and taxes for this classification.
To import Emmc Emcp Socket Usb Sd I from China, negotiate shipping terms (FOB, CIF, or EXW) directly with Shenzhen Hongyi Electronic Technology Co., Ltd.. Ensure you have the necessary import licenses for Electric Components products in your destination country.
Yes, Shenzhen Hongyi Electronic Technology Co., Ltd. is a verified supplier on EximNext. You can view their complete company profile, business registration details, certifications, and export history before placing a bulk order.
The key specifications for Emmc Emcp Socket Usb Sd Interface supplied by Shenzhen Hongyi Electronic Technology Co., Ltd. include BGA Test Socket for eMMC/eMCP Chips, BGA153, BGA162, BGA169, BGA186, BGA221, and Samsung, Sandisk, Toshiba, Hynix, Micron, MTK, Intel. For a complete technical data sheet or Certificate of Analysis (COA), send an inquiry directly to the supplier through EximNext.
Shenzhen Hongyi Electronic Technology Co., Ltd. offers Emmc Emcp Socket Usb Sd I with standard export packaging. Custom packaging, private labeling, and OEM/ODM options may also be available for large wholesale orders.
Emmc Emcp Socket Usb Sd I is actively imported by buyers worldwide. Request a destination-specific CIF or CFR quote from Shenzhen Hongyi Electronic Technology Co., Ltd. through our platform.
Shenzhen Hongyi Electronic Technology Co., Ltd. maintains international quality certifications. These ensure that the Emmc Emcp Socket Usb Sd I meets international quality, safety, and regulatory standards required for cross-border trade.
Click "Request Quotation" on this product page, specify your required quantity, preferred shipping terms, and destination country. Shenzhen Hongyi Electronic Technology Co., Ltd. will respond with a detailed wholesale quote including FOB pricing, lead time, and payment options.
Common payment methods include Letter of Credit (L/C), Telegraphic Transfer (T/T), Documents against Payment (D/P), and Escrow services. Confirm accepted terms directly with Shenzhen Hongyi Electronic Technology Co., Ltd..
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