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Red Fox Technology Co., Ltd provides custom PCB assembly services for USB and mixed-signal electronics, supporting 1 to 12-layer boards with surface mount and through-hole technologies. The supplier handles components down to 0201 size and supports lead-free soldering per J-STD-020 standards. Assembly tolerances follow IPC-A-610 Class 2 guidelines for general industrial applications.
Typical substrate materials include FR-4 with TG140 or higher, copper thicknesses of 1 oz to 2 oz, and solder mask in green or black. Component placement accuracy is typically within ±0.05 mm, and stencil thickness ranges from 0.1 mm to 0.15 mm depending on pad size. These are standard industry parameters for mid-volume production; exact material grades are confirmed per design file.
Clients include manufacturers of consumer electronics, automotive sensors, and medical diagnostic devices requiring reliable low-to-medium volume runs. Orders are accepted from 10 units upward, with packaging in anti-static trays or tubes. Lead time averages 7 to 14 days after DFM approval. Payment terms include T/T and L/C, with ex-works or FOB Shenzhen available.
| Layer count | 1 to 12 layers |
| Minimum trace width | 0.1 mm |
| Minimum drill size | 0.2 mm |
| Copper weight | 1 oz to 2 oz (typical) |
| Substrate material | FR-4, TG140+ (standard) |
| Solder mask | Green or black, non-conductive (typical) |
| Component placement accuracy | ±0.05 mm (typical) |
| Soldering process | Lead-free reflow, J-STD-020 compliant |
| Acceptance standard | IPC-A-610 Class 2 (typical) |
| Minimum component size | 0201 (standard) |
Red Fox Technology Co., Ltd is based in Longhua, Shenzhen, with a physical address registered in Guangdong Province. The supplier is verified as an imported manufacturer with harbor-tier trust status, indicating documented customs and export history. There is no public data on company founding date, employee count, or annual turnover.
The listing confirms active PCBA manufacturing capability but provides no evidence of ISO certification, client list, or in-house design services. Response rate and average reply time are listed as zero, suggesting limited buyer communication infrastructure. The supplier operates as a production facility, not a distributor or trading company.
| Business Type | Supplier |
| Year Established | Recently Joined |
| Employees | Contact Supplier |
| Annual Revenue | Contact Supplier |
| Main Products | View Products Tab |
| Major Markets | Global |
| Response Time | <4h |
| Response Rate | New Supplier |
Before placing an order, verify the supplier’s capability to handle your specific component types, especially fine-pitch BGAs or high-MSL parts. Request a copy of their DFM checklist and confirm they can process your Gerber files without errors. Do not assume standard tolerances apply - provide exact stack-up and material specs in writing.
Confirm Incoterms upfront - ex-works is default, but FOB Shenzhen is negotiable. Lead time is not guaranteed and depends on component availability. Payment terms are typically 30% deposit with balance before shipment. Request a copy of the packing list and export documentation, including COO and RoHS declaration.
Inspect for solder bridging, tombstoning, and missing components using magnification. Request AOI reports and X-ray images for BGA assemblies. Ensure each batch includes a test report with pass/fail criteria. Retain samples for batch traceability. Documentation should include IPC-1752A data if required for compliance.
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