Import Customize Fpc — Buy in Bulk from Supplier in China

Sinodel Electronic Holding Ltd supplies customized Flexible Printed Circuits with precise manufacturing for high density electronic layouts. The FPCs feature a minimum trace width of 0.075mm and a minimum space between traces of 0.075mm, enabling compact designs for advanced applications. The minimum hole size is 0.25mm, supporting fine pitch components and intricate circuitry.

These circuits are built with polyimide substrates, typical for FPCs, offering flexibility and thermal stability across a broad operating range. The tailored thickness options accommodate single layer, double layer, or multilayer configurations, standard in the industry for different signal integrity and impedance control needs. The material’s inherent durability suits dynamic bending and folding in tight spaces without degradation.

Common applications include smartphones, wearables, and medical monitoring devices where space and reliability are critical. Buyers typically source these in bulk with secure packaging to prevent damage during transit. Incoterms such as FOB or CIF are standard for international shipments, and payment methods like L/C or T/T facilitate smooth transactions. Verify exact thickness options and substrate grades before ordering to match project requirements.

Sinodel Electronic Holding Ltd is based in Guangzhou, Guangdong, China, with its registered address at 3, East 1st Street, Changban New Village, Tianhe District. The company operates as an imported tier supplier, indicating it sources or manufactures components for international markets. Its profile does not state a response rate, so direct contact is advised for urgent inquiries.

The supplier specializes in customized Flexible Printed Circuits, offering tailored solutions for electronic designs. No additional details such as certifications, production capacity, or client history are provided in the profile, so buyers should confirm these directly. The focus remains on delivering FPCs that meet precise technical specifications for high density applications.