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Yuan Rong Da Micro Electronic Co., located in Zhongyuguan Industrial Park, Shenzhen 518105, Guangdong, China, manufactures the BGA 272 test socket designed for Infineon chip applications. The BGA 272 designation refers to a ball grid array package with 272 solder ball interconnects, requiring a socket with matching 272-contact footprint and 1.27 mm or 1.0 mm standard ball pitch (typical for this package family). The socket functions as a test and burn-in fixture, enabling repeated insertion and removal of BGA-packaged integrated circuits without solder attachment during validation and production testing phases.
The supplier indicates ten years of research and manufacturing experience in semiconductor test sockets, with the BGA 272 product falling within their broader programme of chip test sockets, programming fixtures, and automated test solutions. BGA 272 sockets typically employ phosphor bronze or beryllium copper contact fingers with gold plating over nickel (standard: 3-10 microinches Au) to ensure reliable electrical contact and resist oxidation across temperature cycling. The base material is commonly polyetherimide (PEI) or polyphenylene sulfide (PPS) for dimensional stability up to 150-180 degrees Celsius during burn-in operations. Contact resistance, insertion force, and cycle life are critical unquoted parameters that buyers must confirm directly with the supplier.
Primary applications include incoming inspection, engineering validation, production programming, and reliability testing of BGA 272-packaged devices in sectors such as automotive electronics, telecommunications infrastructure, and industrial control systems. The socket targets semiconductor manufacturers, contract electronics manufacturers (CEMs), original design manufacturers (ODMs), and independent programming houses. Yuan Rong Da Micro Electronic Co. does not list MOQ, unit pricing, or lead-time commitments, so buyers must negotiate these terms directly. The supplier's classification as 'imported' tier with 'harbor' trust status suggests verified marketplace entry but provides no performance track record.
| Package Type | BGA 272 (Ball Grid Array, 272 balls) |
| Intended Chip Manufacturer | Infineon (per supplier description) |
| Socket Category | Test socket / burn-in fixture |
| Typical Ball Pitch | 1.27 mm or 1.0 mm (standard for BGA 272 family) |
| Contact Material | Phosphor bronze or beryllium copper with Au/Ni plating (typical industry standard) |
| Base Material | PEI or PPS (standard for high-temperature test sockets) |
| Typical Operating Temperature | Up to 150-180 degrees Celsius (typical burn-in range, not supplier-confirmed) |
| Contact Resistance | Confirm with supplier (typical: <50 milliohms for quality BGA sockets) |
| Cycle Life | Confirm with supplier (typical: 10,000+ insertions for production-grade sockets) |
| Manufacturing Experience | Ten years (per supplier claim) |
Yuan Rong Da Micro Electronic Co. is situated in Zhongyuguan Industrial Park, Shenzhen 518105, Guangdong Province, China, within one of the world's densest concentrations of electronics manufacturing and supply chain infrastructure. The supplier's tier is marked as 'imported' with 'harbor' trust classification, and like the companion listing, shows zero response rate and zero average response hours, indicating limited or untested enquiry handling within the platform environment. The company describes itself as engaged in semiconductor test programme development, manufacturing, and sales, with a stated specialisation spanning chip test sockets, programming fixtures, and automated test equipment.
The profile does not disclose factory floor area, ISO certification status, annual revenue, employee count, or named customers. No patent holdings, R&D expenditure figures, or quality management system registrations are mentioned. The ten-year operational claim is present in the source description but cannot be independently verified from the provided data. Buyers should conduct their own verification of Yuan Rong Da Micro Electronic Co.'s business licence, export credentials, and any ISO 9001 or ISO 17025 certifications relevant to test equipment manufacturing before placing orders.
| Business Type | Supplier |
| Year Established | Recently Joined |
| Employees | Contact Supplier |
| Annual Revenue | Contact Supplier |
| Main Products | View Products Tab |
| Major Markets | Global |
| Response Time | <4h |
| Response Rate | New Supplier |
Before ordering the BGA 272 test socket from Yuan Rong Da Micro Electronic Co., request a complete mechanical and electrical specification package including dimensional drawings, material certificates, and contact plating reports. Verify that the socket footprint matches your specific Infineon device variant, as BGA 272 packages may differ in ball pitch, depopulation pattern, or body size. Insist on sample units for qualification before committing to volume, and document any acceptance criteria for contact resistance consistency, insertion force repeatability, and thermal performance under your actual test conditions.
Logistics from Zhongyuguan Industrial Park, Shenzhen, typically proceed through Shenzhen Port or Hong Kong, with standard Incoterms being EXW, FOB Shenzhen, or CIF depending on buyer preference. Lead times for custom test sockets in the Chinese semiconductor accessory market commonly range from 4-8 weeks for initial orders, with repeat orders potentially faster. Payment terms should be negotiated with caution given the zero response rate; consider using escrow services or letters of credit for initial transactions, and request references from existing customers in your region to validate delivery reliability.
Incoming inspection of BGA test sockets should include visual verification of contact alignment under magnification, electrical continuity testing of every contact path, and dimensional verification against the device mechanical sample. Conduct a sample burn-in cycle run to confirm thermal stability and contact resistance drift within specification. Retain all documentation from Yuan Rong Da Micro Electronic Co. for traceability, including lot numbers and calibration certificates. If the socket will be used in a production test environment, establish a preventive maintenance schedule based on cycle count rather than calendar time, and monitor for contact wear indicators such as increased insertion force or intermittent opens.
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Securing a reliable supply chain for Bga 272 is critical for maintaining your business operations. Yuan Rong Da Micro Electronic Co., a verified supplier located in China, provides high-quality Bga 272 ready for international export. By connecting directly with this supplier, buyers can bypass intermediaries, negotiate custom wholesale pricing, and arrange bulk shipments. This product is a key offering within the Products industry, catering to distributors, wholesalers, and importers worldwide.
Navigating the complexities of global sourcing is easier when you have direct access to the right manufacturers and exporters. When importing Bga 272 from China, buyers can discuss shipping logistics, packaging requirements, and preferred payment terms directly with Yuan Rong Da Micro Electronic Co.. This seamless communication is powered by EximNext, a premier online B2B marketplace that connects ambitious buyers with verified global sellers across every major industry.
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