Import 5050led Ceramic Substrate — Buy in wholesale FOB from Supplier in China

The 5050LED ceramic substrate from Folysky Technology is an Al2O3 or AlN-based circuit carrier sized to match the 5.0 mm x 5.0 mm footprint of SMD 5050 LED packages, providing electrical interconnection and thermal dissipation in a single layer or multilayer format. The substrate leverages direct bond copper or active metal brazing to achieve high bonding strength and solderability, with line and space resolution down to 20 micrometres according to the supplier's process claims. Unlike organic FR-4 boards, the all-ceramic construction eliminates outgassing, withstands cosmic radiation, and maintains dimensional stability across temperature cycles from -55°C to 200°C and beyond. The product targets applications where organic substrates fail: high-power LED modules, photosensitive resistor assemblies, aerospace instrumentation, and high-frequency RF circuits.

Ceramic substrates for LED applications typically use 96 percent alumina for general lighting and aluminium nitride for thermal conductivity above 170 W/mK; the specific grade for this 5050 variant is not stated. The supplier notes capability for blind vias, 3D routing, and three-dimensional substrate shaping without mould tooling, suggesting a photosensitive or laser-machining process rather than conventional punch-and-sinter. Copper trace thickness, surface finish (ENIG, OSP, or bare copper), and dielectric breakdown voltage are critical for LED thermal management yet absent from the source description. Standard industry practice for 5050 LED carriers is 0.5-1.0 mm substrate thickness with 35-70 micrometre copper, but buyers must confirm these dimensions against their reflow profile and mechanical enclosure.

Purchasers include LED package houses, optoelectronic sensor manufacturers, and aerospace electronics contractors seeking domestic-Chinese ceramic PCB sourcing. The substrate is relevant to photosensitive resistor construction, where cadmium sulphide deposition on ceramic with wire and resin encapsulation forms the sensor stack. Trade terms, price band, and minimum order quantity are not disclosed in the available data. Buyers should request thermal impedance data, CTE matching to the LED die, and reliability test reports (thermal cycling, HAST, high-temperature storage) before committing to volume procurement from Folysky Technology.

Folysky Technology Co., Ltd. is based in Wuhan, Hubei Province, 430200, China, operating from an city known for optoelectronics research and semiconductor manufacturing rather than the Pearl Delta electronics cluster. The supplier holds a harbor trust tier, indicating basic platform verification. Response metrics show 0.00 percent response rate and zero average response hours, signalling either limited platform engagement or a data reporting gap. Buyers should initiate contact early and consider a factory visit to Wuhan to assess cleanroom classification, metallisation line capability, and ceramic sintering furnace capacity before large orders.

The company profile positions itself as a technology-driven ceramic circuit board specialist with emphasis on custom production, short cycle times, and no-mould 3D shaping. No founding year, employee count, revenue, patent portfolio, or named aerospace or LED clients are provided in the source material. The product description references photosensitive resistor substrates and high-reliability aerospace applications, suggesting a dual-market strategy in commodity optoelectronics and niche defence/aerospace. Buyers are advised to request AS9100 or equivalent aerospace quality certification if targeting aviation end-use, and to verify that the 5050LED substrate has actual shipment history rather than being a catalogue-only spec.