Import Bga Solder Ball — Buy in wholesale FOB from Supplier in China

Qingdao Stargood Nonferrous Metal Co., Ltd. supplies lead-free BGA solder balls manufactured from a tin-copper alloy with a composition of 99.3 percent tin and 0.7 percent copper. The product is available in three standard diameters: 13 mm, 19 mm, and 22 mm, with custom sizing available on request. Weight specifications are also customisable to match specific reflow profiles and customer requirements. These solder balls serve as conductive interconnects in ball grid array packaging, melted through controlled heating to form permanent metallurgical bonds between component substrates and printed circuit boards.

The 99.3/0.7 Sn-Cu alloy conforms to common lead-free soldering standards, offering a melting point near 227 degrees Celsius, though the exact liquidus temperature should be confirmed with the supplier. The material exhibits good wettability and fluidity during reflow, promoting consistent joint formation without excessive voiding. Antioxidant elements are incorporated into the alloy composition to reduce oxide formation during repeated thermal cycling. In typical BGA applications, ball sphericity and diameter uniformity are critical to coplanarity and subsequent board-level reliability, so buyers should request dimensional tolerance data and sphericity measurements if not provided in the certificate of analysis.

These solder balls are used primarily in the production and rework of BGA-mounted integrated circuits, including microprocessors, memory modules, and FPGA devices. The product suits both OEM board assembly houses and independent rework service providers handling component replacement and reballing operations. Buyers in the electronics manufacturing services sector typically require ball-to-ball consistency within tight tolerances to maintain placement accuracy during high-speed assembly. When sourcing from Qingdao Stargood, confirm the exact alloy certification, available diameter tolerances, and packaging format, as these details are not fully stated in the listing and vary according to order volume and application class.

Qingdao Stargood Nonferrous Metal Co., Ltd. is headquartered in the Qingdao West Coast Economic Industrial Zone, Qingdao, China, postal code 26600. The supplier holds a harbor trust tier on the platform, with a response rate currently recorded at 0.00 percent and an average response time of zero hours, indicating that no response data has been accumulated or the profile is not yet active in platform communications. The company specialises in nonferrous metal products, with BGA solder balls forming part of its solder product line alongside other tin-based materials.

The listing provides limited verification signals beyond the harbor tier designation. No information is given about ISO certification, production capacity, in-house testing capabilities, or export history. Buyers should treat the supplier profile as requiring direct due diligence, specifically requesting quality management system documentation, alloy analysis certificates, and references from prior electronics industry clients before committing to volume orders.